Results 121 to 130 of about 254,560 (354)
Low-cost technology for the integration of micro- and nanochips into fluidic systems on printed circuit board: fabrication challenges [PDF]
, 2012 Nowadays, micro- and nanochips are usually\ud fabricated with Silicon and/or glass. A simple, low-cost and\ud reliable integration packaging method that provides flexibility\ud to the incorporation of electronic and fluidic devices into a\ud system has ...
Akkerman, R. +6 more
core +2 more sources
Conductive lithographic films [PDF]
This paper reports progress in the development of a novel fabrication technique for printing circuit board designs directly onto suitable substrates. Circuit tracks can be formed on organic or synthetic substrates by depositing films of a metal-loaded ...
Evans, PSA, Harrison, DJ, Ramsey, BJ
core +1 more source
Selection Strategies for Flexible Pressure Sensor Electrode Materials Toward Ultrafast Response
Advanced Functional Materials, EarlyView.This study reveals, for the first time, how the electrode–organic interface governs the temporal performance of flexible pressure sensors. By pairing high‐conductivity CVD PEDOT with commonly used metal electrodes, the authors demonstrate that interfacial energy alignment dictates microsecond‐scale response, providing a straightforward design strategy ...
Jinwook Baek +11 more
wiley +1 more source
Use of gravity separation in metals concentration from printed circuit board scraps [PDF]
, 2014 Hugo Marcelo Veit +2 more
openalex +1 more source
Advanced Functional Materials, EarlyView.A new class of living liquid metal composites is introduced, embedding Bacillus subtilis endospores into eutectic gallium–indium (EGaIn). The spores enhance droplet coalescence, strengthen interfacial conductivity, and provide on‐demand electrogenic functionality after germination. The composites exhibit high conductivity, self‐healing, patternability,
Maryam Rezaie, Yang Gao, Seokheun Choi
wiley +1 more source
Prevention of cracking of soldered joints in electronic assemblies [PDF]
, 1970 Printed circuit board design allows for thermal stressing of the soldered joints during many thermal cycles. Components' leads should be cleaned, tinned, and freed of particles that prevent solder adherence, have a thin conformal coating, and have an air
Beasley, B.
core +1 more source
Electron–Matter Interactions During Electron Beam Nanopatterning
Advanced Functional Materials, EarlyView.This article reviews the electron–matter interactions important to nanopatterning with electron beam lithography (EBL). Electron–matter interactions, including secondary electron generation routes, polymer radiolysis, and electron beam induced charging, are discussed.
Camila Faccini de Lima +2 more
wiley +1 more source
Advanced Functional Materials, EarlyView.An epi‐intraneural interface is developed through in silico optimization and a novel tridimensional microfabrication pipeline. The device integrates penetrating and epineural contacts on a flexible substrate. Mechanical, electrochemical, and in vivo testing in rat and pig reveal robust implantation, low‐threshold activation, and site‐dependent ...
Federico Ciotti +14 more
wiley +1 more source
Large 2D Coulomb crystals in a radio frequency surface ion trap
, 2012 We designed and operated a surface ion trap, with an ion-substrate distance of 500\mum, realized with standard printed-circuit-board techniques. The trap has been loaded with up to a few thousand Sr+ ions in the Coulomb-crystal regime.
Dubessy, R. +5 more
core +1 more source