Results 171 to 180 of about 23,349 (314)

Discrete Out-of-Plane Coupling Components for Printed Circuit Board-Level Optical Interconnections [PDF]

open access: green, 2007
Jürgen Van Erps   +4 more
openalex   +1 more source

Thermal Processing Creates Water‐Stable PEDOT:PSS Films for Bioelectronics

open access: yesAdvanced Materials, Volume 37, Issue 13, April 2, 2025.
Instead of using chemical cross–linkers, it is shown that PEDOT:PSS thin films for bioelectronics become water‐stable after a simple heat treatment. The heat treatment is compatible with a range of rigid and elastomeric substrates and films are stable in vivo for >20 days.
Siddharth Doshi   +16 more
wiley   +1 more source

Advances in Photonic Materials and Integrated Devices for Smart and Digital Healthcare: Bridging the Gap Between Materials and Systems

open access: yesAdvanced Materials, EarlyView.
This article summarizes significant technological advancements in materials, photonic devices, and bio‐interfaced systems, which demonstrate successful applications for impacting human healthcare via improved therapies, advanced diagnostics, and on‐skin health monitoring.
Seunghyeb Ban   +5 more
wiley   +1 more source

Robust Full‐Surface Bonding of Substrate and Electrode for Ultra‐Flexible Sensor Integration

open access: yesAdvanced Materials, EarlyView.
A direct hybrid bonding method that enables both gold and parylene bonding without adhesives is developed. This technique achieves full‐surface direct bonding of electrodes and substrates in flexible electronic connections. The method offers high flexibility, stable mechanical durability, and high‐resolution interconnections, accommodating varying ...
Masahito Takakuwa   +9 more
wiley   +1 more source

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