Printed Circuit Board (PCB) Technology for Electrochemical Sensors and Sensing Platforms. [PDF]
Biosensors (Basel), 2020 Shamkhalichenar H, Bueche CJ, Choi JW.
europepmc +1 more source
Ferroelectrics Hybrids: Harnessing Multifunctionality of 2D Semiconductors in the Post‐Moore Era
Advanced Materials, EarlyView.In this Review, the state of art of ferroelectric hybrid systems—combining ferroelectrics, 2D semiconductors, and molecular switches is presented—as next‐generation platforms for high‐density, multifunctional electronics. By discussing 2D FeFET applications, nanoscale material downscaling, M3D integration, and emerging ferroelectrics, it highlights ...
Haixin Qiu +3 more
wiley +1 more source
A dataset for deep learning based detection of printed circuit board surface defect. [PDF]
Sci DataLv S +7 more
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Sustainable Structural Hot‐Melt Adhesives Enabled by Functionalized Crystalline Lamellae
Advanced Materials, EarlyView.A high‐performance, recyclable hot‐melt adhesive is developed from renewable materials. It features functional crystalline lamellae that enhance shear strength and enable closed‐loop recycling. The adhesive also provides excellent water and oxygen barrier properties, meeting both sustainability and performance demands for advanced bonding and sealing ...
Zhitao Hu +7 more
wiley +1 more source
Attentive context and semantic enhancement mechanism for printed circuit board defect detection with two-stage and multi-stage object detectors. [PDF]
Sci RepKiobya T, Zhou J, Maiseli B, Khan M.
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Aqueously Upcycled Lignin with Emergent Tribonegativity for Skin‐Integrated Triboelectronics
Advanced Materials, EarlyView.Aqueously upcycled lignin is transformed into a printable ink that self‐assembles into a nanotextured surface during printing with the highest reported biopolymer‐based tribonegativity. The resulting skin‐integrated triboelectric sensor enables high‐fidelity cardiovascular monitoring and objective mental workload classification, demonstrating a ...
Robert Ccorahua‐Santo +3 more
wiley +1 more source
Silver Recovery from E-Waste Printed Circuit Board Using Binary and Ternary Deep Eutectic Solvents
Arrizal Abdul Aziz +6 more
openalex +2 more sources
Flip Chip Bonding on Epoxy Base Printed Circuit Board.
, 1997 Yutaka Tsukada
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