Results 281 to 290 of about 240,145 (341)
Progress in Flexible Perovskite Solar Cells: Paving the Way for Scalable Manufacturing
Perovskite solar cells (PSCs) are well positioned for a successful market uptake. This is due to an unprecedented improvement of their efficiency and stability since the first report in 2009. In this review paper, the building blocks for the scalable manufacturing and future commercialization of flexible PSCs and their pathway to impact will be ...
Dimitar I. Kutsarov+5 more
wiley +1 more source
Promising Technologies and Trend of Print Circuit Board for the Electronics Packaging
openalex +2 more sources
Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek+4 more
wiley +1 more source
High Aspect Ratio, Superconducting Vacuum Gap Capacitor NEMS with Plate Distances Down to 32 nm
Fabrication of aluminium vacuum gap capacitor based NEMS is investigated with a free to move top electrode. To avoid collapse of the top electrode vertical stress gradient is controlled through sputter parameters. The result is wafer‐level high‐yield fabrication of vacuum gap capacitors with radii between 7 µm and 30 µm and integrated piezoactuators. A
Ioan Ignat, Daniel Platz, Ulrich Schmid
wiley +1 more source
Performance Evaluation of Wavelet-Based Algorithm for Printed Circuit Board (PCB) Inspection
Zuwairie Ibrahim+3 more
openalex +2 more sources
Artificially Weaved Textile‐like Surface Micromachined Graphene‐Polymer Flexible Bioelectrodes
This study reports on the engineering of microscale textured surfaces of SU‐8/PMMA polymer composites much like a “weft‐warp” pattern to resemble “artificially‐weaved” textiles. These microstructured surfaces enable conformal layering of functional reduced graphene oxide (rGO), all‐in‐all offering favorable features including remarkable self ...
Seba Nur Alhasan+6 more
wiley +1 more source
A novel multi‐stamping on multi‐prestrain (MSMP) process is proposed, where sensor elements are transferred onto a substrate under different prestrains (0–150%) within a single integrated platform. This MSMP approach not only resolves the mismatch issue in stretchable wearable electronics, but also ensures that each sensor element exhibits optimal ...
Jae In Kim+9 more
wiley +1 more source
This article presents a novel strategy for creating highly stretchable wireless circuits using electrical metamaterial‐based interconnects (EMIs). Embedded in soft polymers and filled with liquid metal, EMIs uniquely reduce resistance under strain. A fully integrated ECG circuit demonstrates reliable performance under 100% stretch, offering a highly ...
Anan Zhang+2 more
wiley +1 more source
A corrugated origami TENG (CO‐TENG) soft sensor utilizes paper self‐folding technology to create battery‐free devices by laminating and folding sheet materials. In the object drop test, the voltage generated by CO‐TENG is classified with machine learning to achieve an accuracy of 98.9%, which shows its potential for smart cushioning devices.
Haruki Higoshi+8 more
wiley +1 more source