Results 21 to 30 of about 23,349 (314)
Automated Low Investment Cost Evaporometers (ALICEs)
Applied Sciences, 2021 Evaporation is an important part of the hydrological cycle. This paper discusses the materials and methods we used to develop an evaporometer, which measures evaporation from the water surface, like a drop in water level.
Adam Tejkl, Petr Kavka
doaj +1 more source
MIN: Moiré Inpainting Network With Position Adaptive Mask for 3-D Height Reconstruction
IEEE AccessIn the AI-driven computer vision industry, height measurement of Printed Circuit Board images typically relies on laser or Moiré methods. In this paper, we focus on the Moiré method, known for its high accuracy and fast measurement speed ...
Tae-Jung Kim +3 more
doaj +1 more source
Advanced Engineering Materials, EarlyView.This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan +5 more
wiley +1 more source
Design of a Low-Profile Dual Linearly Polarized Antenna Array for mm-Wave 5G
IEEE Access, 2023 This work proposes a dual linearly polarized antenna array for 5G mm-wave band, which is designed to be compatible with planar printed circuit board technology.
Marco Simone +7 more
doaj +1 more source
Advanced Engineering Materials, EarlyView.This study identifies 12 wt% indium (In) as the optimal composition for Sn0.5Ag0.7Cu5Bi solder joints, achieving 87% ductile fracture and 81% suppression of intermetallic compound (IMC) growth versus 4 wt% In. High‐In alloys (15–17 wt%) show abnormal IMC thickening due to thermal activation.
Liuwei Wang +11 more
wiley +1 more source
Надежность и качество сложных систем, 2023 Background. An analysis is made of the thermal effect of two internal parallel printed circuit board conductors located in one layer, which are installed on a metal base (on top of each other) and operate in space vacuum conditions.
Aleksey V. Kostin +2 more
doaj +1 more source
Advanced Engineering Materials, EarlyView.A simple, cleanroom‐free method produces flexible mini‐coils using automated blade cutting. The process is fast, low‐cost, and supports diverse materials. The coils show strong durability and performance under repeated bending. Demonstrated use in resistor‐inductor filters and magnetic nanoparticle control proves their adaptability.
Changhao Ge +5 more
wiley +1 more source
Merging polygons on two-layer printed circuit board [PDF]
Технологія та конструювання в електронній апаратурі, 2011 A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board.
S. Yu. Murov
doaj +1 more source
Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band
IEEE Open Journal of Antennas and Propagation, 2020 This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and
Antti Lamminen +4 more
doaj +1 more source
Advanced Engineering Materials, EarlyView.In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García +3 more
wiley +1 more source