Results 41 to 50 of about 240,145 (341)
Response Spectrum Analysis of Printed Circuit Boards Subjected to Shock Loads [PDF]
A spacecraft consists of a number of electronic packages to meet the functional requirements. An electronic package is generally an assembly of printed circuit boards placed in a mechanical housing.
Jayaraman, S.+4 more
core +1 more source
Wearable Haptic Feedback Interfaces for Augmenting Human Touch
The wearable haptic feedback interfaces enhance user experience in gaming, social media, biomedical instrumentation, and robotics by generating tactile sensations. This review discusses and categorizes current haptic feedback interfaces into force, thermal, and electrotactile stimulation‐based haptic feedback interfaces, elucidating their current ...
Shubham Patel+3 more
wiley +1 more source
Integrated circuit flat-pack lead bender [PDF]
Tool bends leads quickly and accurately for mounting on printed circuit boards.
Koster, C. H.
core +1 more source
Insertion loss and misalignment tolerance in multimode tapered waveguide bends [PDF]
Experimental measurements of laterally tapered multimode waveguide bends fabricated photolithographically on FR4 printed circuit board establish that the product of the mean insertion loss (in linear units) and the mean source misalignment tolerance is a
Papakonstantinou, I+2 more
core +1 more source
The Emerging 4D Printing of Shape‐Memory Thermomorphs for Self‐Adaptative Biomedical Implants
4D printing enables the creation of smart implants that adapt to changing conditions in the human body over time. At the core of this technology are shape‐memory thermomorphs (SMTMs). This review offers an in‐depth analysis of 4D printing with SMTMs, emphasizing the latest advancements in smart materials, stimuli, programming principles, and their ...
Aixiang Ding, Fang Tang, Eben Alsberg
wiley +1 more source
FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers [PDF]
The protocol data rate governing data storage devices will increase to over 12 Gb/s by 2013 thereby imposing unmanageable cost and performance burdens on future digital data storage systems.
Baghsiahi, H+8 more
core +4 more sources
Holographic stress analysis [PDF]
Device for nondestructive testing of soldered joints correlates stress with load to predict printed circuit board ...
Williams, J. R.
core +1 more source
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger+4 more
wiley +1 more source
Bi‐directionally assembled BN µ‐platelets in micropatterns formed by a micro‐molding method for thermal interface materials are demonstrated. The BN µ‐platelets are vertically aligned selectively, while compressed regions without patterns accommodate horizontally assembled BN µ‐platelets. Through anisotropic orientation, high thermal conductivities for
Young Gil Kim+12 more
wiley +1 more source
Accurate Models for Evaluating the Direct Conducted and Radiated Emissions from Integrated Circuits
This paper deals with the electromagnetic compatibility (EMC) issues related to the direct and radiated emissions from a high-speed integrated circuits (ICs). These emissions are evaluated here by means of circuital and electromagnetic models. As for the
Domenico Capriglione+2 more
doaj +1 more source