Results 51 to 60 of about 240,145 (341)
Carbon Nanotube 3D Integrated Circuits: From Design to Applications
Advanced Functional Materials, EarlyView.As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu +3 more
wiley +1 more source
Application of the technology of thin films and nanostructured materials in the manufacture of thermally loaded printed circuit boards [PDF]
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2011 The expediency is shown for application of aluminum nitride thin films, which has unique physical and chemical properties, for high heat resistance of the circuit board.
Sakhno E. A. +3 more
doaj
High power printed circuit board design for automotive fuse block usage
Dyna, 2017 The minimal size for the conductor calculation is always the first point of interest when an electrical designer is creating a High Power Printed Circuit Board for automotive applications; in this paper you will see the factors considered to calculate ...
Ivan Juan Carlos Perez Olguin
doaj +1 more source
Advanced Functional Materials, EarlyView.This study demonstrates the use of a low‐cost 3D printing technique to prepare a large‐area PVDF‐FAPbI3 composite dielectric film for flexible TENG application. The δ→α phase transformation of the FAPbI3 nanofillers has significantly improved the β‐phase content, morphology, and dielectric properties of the PVDF film.
Nurfatin Hafizah Zain Karimy +7 more
wiley +1 more source
Fabrication of MEMS on Printed Circuit Boards [PDF]
ECS Transactions, 2010 There are many ways to manufacture Micro Electro-mechanical Systems (MEMS). For thin-film fabrication of integrated MEMS parts, several different techniques (like etching and electroplating) are applied. Typically, the whole fabrication of MEMS devices is conducted on a carrier wafer, which is fixed and bonded on a Printed Circuit Board (PCB).
Lutz Rissing +2 more
openaire +2 more sources
Compact coaxial connector for printed circuit adds reliability [PDF]
, 1964 Soldering and welding techniques are used to connect a coaxial cable to a printed circuit board.
Radecke, T. F.
core +1 more source
Advanced Functional Materials, EarlyView.This work presents π–conjugated polymers based on dihydropyrazine (DHP) and ethylenedioxythiophene (EDOT), developed to produce highly conductive, flexible films for printed electronics. By optimizing the DHP and EDOT ratio, strong and compact π–π stacking is achieved, resulting in polymer films with conductivities up to 1700 S cm−1 under ambient ...
Sung Jae Jeon +3 more
wiley +1 more source
Merging polygons on two-layer printed circuit board [PDF]
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2011 A method is proposed for solving the problem of connection of maximum number of isolated islands of metallized areas of the same chain, located on different layers of the printed circuit board.
Murov S. Yu.
doaj
Pelarutan Selektif Tembaga dari Limbah Printed Circuit Board dengan Hidrogen Peroksida
Alchemy, 2018 Pelarutan selektif tembaga dari limbah printed circuit board (PCB) telah berhasil dilakukan. Logam tembaga yang terkandung di dalam papan PCB dapat dipisahkan menggunakan campuran hidrogen peroksida dan asam sulfat dengan variasi perbandingan volume 0 ...
Gatut Ari Wardani +2 more
doaj +1 more source
Измерение, мониторинг, управление, контроль, 2022 Background. In modern digital devices, the issue of a comprehensive assessment of transmission lines, which are copper tracks on a printed circuit board and associated structural elements, becomes more and more important.
P.A. Maksimov
doaj +1 more source