Results 61 to 70 of about 240,145 (341)

Standards for compatibility of printed circuit and component lead materials [PDF]

, 1968
Study of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material ...

core   +1 more source

High‐Entropy Liquid Metal Process for Transparent Ultrathin p‐Type Gallium Oxide

Advanced Functional Materials, EarlyView.
This work introduces a doping strategy for harvesting ultrathin Ga oxide layers using a multi‐elemental Ga‐based liquid metal alloy. The incorporation of trivalent In metal into the self‐limiting oxide formed on the alloy's surface is enabled by the existence of atomically dispersed Pt, Au, and Pd.
Laetitia Bardet, Ali Zavabeti, Amar Salih, Dawei Zhang, Mohamed Kilani, Mohammad B. Ghasemian, Anton Tadich, Yunlong Sun, Lucy Johnston, Danyang Wang, Jan Seidel, Francois‐Marie Allioux, Cuong Ton‐That, Jianbo Tang, Kourosh Kalantar‐Zadeh   +14 more
wiley   +1 more source

Hardware design of magnetically isolated gate driver using insulated gate bipolar transistor (IGBT) [PDF]

, 2017
This paper presents the hardware design of compact H-bridge magnetically isolated gate driver using Insulated Gate Bipolar Transistor (IGBT) as power device.
Abdul Harris, Faranadia, Mohammad Noor, Siti Zaliha, Mohd Radzi, Mohd Amran, Omar, Ahmad Maliki, Yusof, Mohd Firdaus   +4 more
core   +1 more source

NanoMOF‐Based Multilevel Anti‐Counterfeiting by a Combination of Visible and Invisible Photoluminescence and Conductivity

Advanced Functional Materials, EarlyView.
This study presents novel anti‐counterfeiting tags with multilevel security features that utilize additional disguise features. They combine luminescent nanosized Ln‐MOFs with conductive polymers to multifunctional mixed‐matrix membranes and powder composites. The materials exhibit visible/NIR emission and matrix‐based conductivity even as black bodies.
Moritz Maxeiner, Ruben Maile, Murat Cuvalli, Andreas Wolf, Ayisha Komal, Robert Oestreich, Christoph Janiak, Karl Mandel, Alexander Knebel, Klaus Müller‐Buschbaum   +9 more
wiley   +1 more source

University proceedings. Volga region. Technical sciences

Известия высших учебных заведений. Поволжский регион:Технические науки
Background. The production of long-term operable complex multilayer printed circuit boards is based on the decision to launch enhanced quality control based on an assessment of the reliability of printed circuit boards.
A.A. Troshin, I.V. Balakhonova
doaj   +1 more source

Integration of Perovskite/Low‐Dimensional Material Heterostructures for Optoelectronics and Artificial Visual Systems

Advanced Functional Materials, EarlyView.
Heterojunctions combining halide perovskites with low‐dimensional materials enhance optoelectronic devices by enabling precise charge control and improving efficiency, stability, and speed. These synergies advance flexible electronics, wearable sensors, and neuromorphic computing, mimicking biological vision for real‐time image analysis and intelligent
Yu‐Jin Du, Junjie Yang, Ziyu Lv, Yongbiao Zhai, Zezhuang Yi, Yuhui Xie, Ming‐Lin Zheng, Xiangyu Ma, Guodong Gong, Yan Wang, Ye Zhou, Su‐Ting Han   +11 more
wiley   +1 more source

Effects of Temperature Annealing on the Intrinsic Transport Mechanisms of Solution Processed Graphene Nanosheet Networks

Advanced Functional Materials, EarlyView.
Unravelling charge transport mechanisms in graphene nanosheet networks: by combining temperature‐dependent conductivity measurements with a Random Resistor Network model, this study identifies a transition from hopping‐dominated conduction to a band‐like transport mechanism.
Alessandro Grillo, Alejandro Toral‐Lopez, Damiano Marian, Aniello Pelella, Zixing Peng, Jingjing Wang, Enver Faella, Maurizio Passacantando, Antonio Di Bartolomeo, Gianluca Fiori   +9 more
wiley   +1 more source

THE LAYOUT OF ON-BOARD ELECTRONIC SYSTEMS WITHOUT RESONANT BLOCKS USING DOUBLE-LAYER PRINTED CIRCUIT BOARDS WITH A RIGID BASE

Надежность и качество сложных систем
Background. The aim of the work is to develop an engineering methodology for calculating printed circuit board assemblies with a rigid substrate. The analysis of methods and techniques for calculating resonance-free (in the operating frequency range ...
S.I. Frolov, E.A. Danilova, I.I. Kochegarov   +2 more
doaj   +1 more source

Physically separating printed circuit boards with a resilient, conductive contact [PDF]

, 1999
A multi-board module provides high density electronic packaging in which multiple printed circuit boards are stacked. Electrical power, or signals, are conducted between the boards through a resilient contact.
Baker, John D., Montalvo, Alberto
core   +1 more source

Understanding and Addressing the Performance Asymmetry Issue in Semitransparent Laminated Organic Photovoltaic Devices

Advanced Functional Materials, EarlyView.
This work addresses the challenge of current–voltage asymmetry in scalable laminated semitransparent organic photovoltaics (OPVs) for indoor applications. Vertical stratification of materials is shown to create an energy barrier, leading to performance differences under different illumination directions.
Gulzada Beket, Anton Zubayer, Leonie Pap, Huagui Lai, Samiran Bairagi, Nakul Jain, Jochen Stahn, Fan Fu, Kenneth Järrendahl, Fredrik Eriksson, Xabier Rodríguez‐Martínez, Olle Inganäs, Uli Würfel, Thomas Österberg, Jonas Bergqvist, Feng Gao   +15 more
wiley   +1 more source