Results 71 to 80 of about 254,560 (354)
Background. The aim of the work is to develop an engineering methodology for calculating printed circuit board assemblies with a rigid substrate. The analysis of methods and techniques for calculating resonance-free (in the operating frequency range ...
S.I. Frolov +2 more
doaj +1 more source
A 3D disease model is developed using customized hyaluronic‐acid‐based hydrogels supplemented with extracellular matrix (ECM) proteins resembling brain ECM properties. Neurons, astrocytes, and tumor cells are used to mimic the native brain surrounding.
Esra Türker +16 more
wiley +1 more source
Background. Improving the reliability of printed circuit boards is associated with reducing the level of their defects in the production process. The task of forecasting the level of defects is especially relevant in a situation where an enterprise ...
A.A. Troshin, I.V. Balakhonova
doaj +1 more source
An Electronics Lab Project: Tutorial and Design of Printed Circuit Board "Big Blinky" [PDF]
Rod B. Foist +2 more
openalex +1 more source
Simple modeling for conducted common-mode current in switching circuits [PDF]
Common mode current strongly depends on stray capacitance of each circuit node, especially those with high dv/dt and di/dt. To build a simple model for conducted common mode current in switching circuit a computer software based on Partial Element ...
Kchikach, M +3 more
core +1 more source
This research presents a novel implantable bio‐battery, GF‐OsG, tailored for diabetic bone repair. GF‐OsG generates microcurrents in high‐glucose conditions to enhance vascularization, shift macrophages to the M2 phenotype, and regulate immune responses.
Nanning Lv +10 more
wiley +1 more source
The paper presents the results of studies of heat fluxes in a printed circuit board made of aluminum with nanoporous anodic alumina, generated by linear heat source.
H. T. Dinh +3 more
doaj
A UV‐crosslinkable soft anisotropic conductive film (ACF) provides high‐resolution, room‐temperature electrical interfacing. Upon UV exposure, azide crosslinkers within the ACF matrix form covalent bonds with a wide range of C–H‐containing materials, resulting in interfaces that are both mechanically durable and electrically reliable.
Jun Choi +7 more
wiley +1 more source
Standards for compatibility of printed circuit and component lead materials [PDF]
Study of packaging of microminiature electronic components reveals methods of improving compatibility of lead materials, joining techniques, transfer molding concepts, printed circuit board materials, and process and material ...
core +1 more source
Hardware design of magnetically isolated gate driver using insulated gate bipolar transistor (IGBT) [PDF]
This paper presents the hardware design of compact H-bridge magnetically isolated gate driver using Insulated Gate Bipolar Transistor (IGBT) as power device.
Abdul Harris, Faranadia +4 more
core +1 more source

