Results 31 to 40 of about 19,868 (354)

Dielectric Barrier Discharge Plasma Deoxidation of Natively Oxide Layer of Copper Powders in a Fluidized Bed

Advanced Engineering Materials, EarlyView.
This paper presents a novel approach to reducing oxide layers on metal powders using low‐temperature hydrogen dielectric barrier discharge plasmas at atmospheric pressure. Unlike conventional hydrogen‐plasma reductions, the powders do not contact the plasma directly.
Shukang Zhang, Annett Wollmann, Thomas Gimpel, Alfred P. Weber   +3 more
wiley   +1 more source

Zinc Oxide Nanowires on Printed Circuit Boards

, 2015
Printed circuit boards (PCBs), which are widely used for the fabrication of electronic circuits, can only withstand rather low temperatures. For this reason, the fabrication of high-density, long ZnO nanostructures on PCBs still remains a complex task.
Errico, V, Falconi, C., Arrabito, Giuseppe Domenico, Han, W, Weihua Han, Christian Falconi, Giuseppe Arrabito, Vito Errico   +7 more
core   +1 more source

Creep Properties and Deformation Mechanism of Additively Manufactured NiAl‐CrMo Composites

Advanced Engineering Materials, EarlyView.
Additively manufactured NiAl‐CrMo composites contain numerous interfaces and cell boundaries that control their creep response. At 700°C under high applied stress, creep is dominated by dislocation‐controlled power‐law mechanisms. At 800°C–900°C and lower stresses, creep is primarily diffusion‐controlled along cell boundaries.
Jan Vollhüter, Andreas Bezold, Johan Westraadt, Katharina Fiegl, Subham Chattoraj, Benjamin Wahlmann, Carolin Körner, Michael Mills, Mathias Göken, Steffen Neumeier   +9 more
wiley   +1 more source

Editorial for the Special Issue on Lab-on-PCB Devices

Micromachines, 2022
The use of Printed Circuit Boards (PCBs) has seen a remarkable growth over the last decade, with applications in engineering, medicine, biology, chemistry, etc [...]
Francisco Perdigones
doaj   +1 more source

Soft Mechanical‐Electrical Logic Using Liquid Metal‐Filled 3D‐Printed Architectures

Advanced Engineering Materials, EarlyView.
We present 3D‐printed soft mechanical–electrical logic elements that use liquid metal–filled silicone tubes actuated by thermoplastic polyurethane/polylactic acid (TPU/PLA) architectures to produce Boolean operations. Complementary normally open and normally closed unit cells perform repeatable binary transitions and can be combined into more complex ...
Christoph Lehmann, Ryan Kalgreen, Laura M. Comella   +2 more
wiley   +1 more source

Printed Integrated Logic Circuits Based on Chitosan‐Gated Organic Transistors for Future Edible Systems

Advanced Functional Materials, EarlyView.
Edible electronics needs integrated logic circuits for computation and control. This work presents a potentially edible printed chitosan‐gated transistor with a design optimized for integration in circuits. Its implementation in integrated logic gates and circuits operating at low voltage (0.7 V) is demonstrated, as well as the compatibility with an ...
Giulia Coco, Valerio Francesco Annese, Valerio Galli, Ilaria Penna, Debora Russo, Marina Veronesi, Rita Scarpelli, Stefania Sabella, Mario Caironi   +8 more
wiley   +1 more source

Aspects of electromagnetic interference on printed circuit boards.

, 1990
General guidelines for the design of printed circuit boards have been developed for two important aspects of electromagnetic compatibility: cross-talk and radiated emissions.
Radojicic, Marko L. M.
core   +2 more sources

Laser‐Induced Graphene from Waste Almond Shells

Advanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova, Anna Chiara Bressi, Marina Galliani, Attilio Marino, Gianni Ciofani, Eduardo Machado‐Charry, Hilda Gomez Bernal, Alessandra Francini, Luca Sebastiani, Francesco Greco   +9 more
wiley   +1 more source

Hot‐Film and Calorimetric Methods With Transient Heating for Measurement of High Biofluid Flow Rate

Advanced Functional Materials, EarlyView.
Accurate measurement of biofluid flow rate is vital for clinical diagnostics. We propose a transient heating strategy using short thermal pulses and peak temperature tracking to enhance the flow sensitivity of the hot‐Film and calorimetric methods. Simulations show how optimal heating time maximizes sensitivity across flow rates.
Yuanting Wei, Shupeng Li, Kyung Rok Pyun, Tianyu Yang, Bosung Kim, Haotian Yang, John A. Rogers, Yonggang Huang, Haohui Zhang   +8 more
wiley   +1 more source

Study of a Novel Electrochemical Method for Copper Recovery from Waste Printed Circuit Boards

Chemical Engineering Transactions, 2017
This study was carried out to recover copper from printed circuit boards of waste computers through an electrochemical process. To simplify the overall recovery process, large pieces of printed circuit boards were used instead of pulverized samples.
C. Cocchiara, S. Piazza, C. Sunseri, R. Inguanta   +3 more
doaj   +1 more source