Results 61 to 70 of about 19,868 (354)

Predicting the level of nonconformities (defects) in printed circuit board production based on their calculated reliability

open access: yesИзвестия высших учебных заведений. Поволжский регион:Технические науки
Background. Improving the reliability of printed circuit boards is associated with reducing the level of their defects in the production process. The task of forecasting the level of defects is especially relevant in a situation where an enterprise ...
A.A. Troshin, I.V. Balakhonova
doaj   +1 more source

CFD–DEM simulation of fluid–solid flow of a tapered column separation bed

open access: yesInternational Journal of Mining Science and Technology, 2015
Research on recycling waste Printed Circuit Boards (PCB) is at the forefront of preventing environmental pollution and finding ways to recycle resources.
Chenlong Duan   +4 more
doaj   +1 more source

Dual‐Mode Magnetic Elastomer for On‐Demand Motion and Degradation

open access: yesAdvanced Functional Materials, EarlyView.
A dual‐mode magnetic elastomer is introduced, enabling DC field‐driven programmable actuation and AC field‐driven magnetothermal degradation. GHz‐range magnetic fields generate ultrafast heating of magnetic nanoparticles that activates cleavage of the silicone elastomer matrix.
Jieun Han   +13 more
wiley   +1 more source

FirstLight: Pluggable Optical Interconnect Technologies for Polymeric Electro-Optical Printed Circuit Boards in Data Centers

open access: yes, 2012
The protocol data rate governing data storage devices will increase to over 12 Gb/s by 2013 thereby imposing unmanageable cost and performance burdens on future digital data storage systems.
Dangel, R   +8 more
core  

Convergence acceleration and accuracy improvement in power bus impedance calculation with a fast algorithm using cavity modes [PDF]

open access: yes, 2005
Based on the cavity-mode model, we have developed a fast algorithm for calculating power bus impedance in multilayer printed circuit boards. The fast algorithm is based on a closed-form expression for the impedance Z matrix of a rectangular power bus ...
Wang, Zhi Liang   +7 more
core   +1 more source

3D Printing Innovations in Polymeric Porous and Patterned Architecture

open access: yesAdvanced Functional Materials, EarlyView.
Polymeric foams occupy a unique structural space between dense solids and open networks, where engineered void fraction governs mechanical compliance, thermal resistance, and mass transport. Additive manufacturing now enables precise spatial control over cellular architecture, unlocking designer foam structures across applications spanning crash ...
Dhanush Patil   +13 more
wiley   +1 more source

Hydrometallurgical Treatment of Waste Printed Circuit Boards: Bromine Leaching

open access: yesMetals, 2020
This paper demonstrates the recovery of valuable metals from shredded Waste Printed Circuit Boards (WPCBs) by bromine leaching. Effects of sodium bromide concentration, bromine concentration, leaching time and inorganic acids were investigated.
Hao Cui, Corby Anderson
doaj   +1 more source

A note on a motion control problem for a placement machine. [PDF]

open access: yes
Assembling printed circuit boards effciently using automated placement machines is a challenging task. Here, we focus on a motion control problem for a specific type of placement machines.
Coene, Sofie   +3 more
core  

Vacuum Formed Spherical Triboelectric Architecture Overcoming Direction Constraints for 3D‐Omnidirectional Ultrasonic Energy Receiving

open access: yesAdvanced Functional Materials, EarlyView.
First vacuum formed spherical triboelectric converter for 3D‐omnidirectional ultrasonic energy receiving, with configurable DC or pulse outputs for versatile applications. ABSTRACT Ultrasound‐driven triboelectric nanogenerators (UD‐TENGs) have emerged as promising ultrasonic energy converters for underwater and biomedical applications.
Yanqin Huang   +12 more
wiley   +1 more source

Electrochemical Migration Behavior of Copper-Clad Laminate and Electroless Nickel/Immersion Gold Printed Circuit Boards under Thin Electrolyte Layers

open access: yes, 2017
The electrochemical migration (ECM) behavior of copper-clad laminate (PCB-Cu) and electroless nickel/immersion gold printed circuit boards (PCB-ENIG) under thin electrolyte layers of different thicknesses containing 0.1 M Na2SO4 was studied.
Li, Xiaogang   +9 more
core   +1 more source

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