Results 111 to 120 of about 1,117,028 (386)

High Fidelity Tape Transfer Printing Based On Chemically Induced Adhesive Strength Modulation [PDF]

open access: yes, 2015
Transfer printing, a two-step process (i.e. picking up and printing) for heterogeneous integration, has been widely exploited for the fabrication of functional electronics system.
A Carlson   +33 more
core   +2 more sources

Inkjet-Printed Electronics on Paper for RF Identification (RFID) and Sensing

open access: yesElectronics, 2020
The newly developed research area of inkjet-printed radio frequency (RF) electronics on cellulose-based and synthetic paper substrates is introduced in this paper.
Sangkil Kim
semanticscholar   +1 more source

Impact of Structural Adhesive Hybridization Strategy on the Performance of In‐Mold Electronics Devices Across Thermoforming and Injection Molding

open access: yesAdvanced Engineering Materials, EarlyView.
In‐mold electronics (IME) undergo complex thermoforming and over‐molding processes that strain device integrity. This study demonstrates how adapting the amount and placement of structural adhesive to local deformation levels preserves electrical functionality.
Francisco Ituriel Arias‐García   +3 more
wiley   +1 more source

Programmable Reconfiguration of Hybrid 4D Chiral Metamaterials via Mechanical and Thermal Stimuli

open access: yesAdvanced Engineering Materials, EarlyView.
A class of hybrid chiral mechanical metamaterials is designed to achieve programmable reconfiguration through soft networks, hinges, and bilayer joints integrated with rigid units. Responsive to mechanical and thermal stimuli, these structures exhibit large volume changes, tunable deformation pathways, and both positive and negative thermal expansion ...
Yunyao Jiang, Siyao Liu, Yaning Li
wiley   +1 more source

Printed Electronics in Radiofrequency Energy Harvesters and Wireless Power Transfer Rectennas for IoT Applications

open access: yesAdvanced Electronic Materials, 2023
The Internet of Things is currently one of the fastest‐growing branches in electronics. The development of energy storage systems and the miniaturization of dedicated printed circuit boards significantly influence that growth.
Kacper Skarżyński, Marcin Słoma
doaj   +1 more source

3D‐Printable Near‐Infrared‐Responsive Microscale Cantilever made of the Composite Consisting of Ceramic Particles and Graphene Flakes

open access: yesAdvanced Engineering Materials, EarlyView.
A near infrared‐responsive microscale cantilever is developed using a 3D‐printable composite based on photocurable resin consisting of sepiolite and graphene flakes. The material absorbs 1064 nm light, causing shape transformation with an average displacement of 1.3 mm in 1.7 s. Displacement is measured via video recording.
Karolina Laszczyk   +3 more
wiley   +1 more source

Additively Manufactured Flexible Electronics Filled with Ionic Liquid for Cryogenic Pressure Sensing

open access: yesAdvanced Devices & Instrumentation
Flexible electronics have attracted increasing attention and are extensively used in medical care and health monitoring applications. However, research on their applications in low-temperature environments is limited, mainly owing to material intrinsic ...
Shuaishuai Meng   +8 more
doaj   +1 more source

Highly Stable Low‐Temperature Phosphate Glass as a Platform for Multimaterial 3D Printing of Integrated Functional Microfluidic Devices

open access: yesAdvanced Engineering Materials, EarlyView.
A highly stable, low‐temperature phosphate glass is developed for multimaterial additive manufacturing of multifunctional microfluidics. Glass, metal conductors, and sacrificial polymer are coprinted, enabling monolithic fabrication. The sacrificial paste forms precise channels and decomposes during sintering.
Babak Mazinani   +2 more
wiley   +1 more source

Examination of silver-graphite lithographically printed resistive strain sensors [PDF]

open access: yes, 2006
This paper reports the design and manufacture of three differing types of resistive strain sensitive structures fabricated using the Conductive Lithographic Film (CLF) printing process. The structures, utilising two inks prepared with silver and graphite
Ahmed   +30 more
core   +2 more sources

Encapsulating Laser‐Induced Graphene to Preserve its Electrical Properties and Enhance its Mechanical Robustness

open access: yesAdvanced Engineering Materials, EarlyView.
It is demonstrated that laser‐induced graphene (LIG) can be encapsulated while preserving its electrical conductivity and enhancing its mechanical properties. Unlike previous encapsulation attempts, the optimal conditions described here result in sheet resistance of ≈2 Ω sq−1, resistance increase of only 5% upon encapsulation, and vastly improved ...
Fatemeh Bayat   +3 more
wiley   +1 more source

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