Results 131 to 140 of about 233,960 (307)

Lottery Action Newsletter, February 7-20, 2011, Vol. 18, no. 3 [PDF]

, 2011
Lottery Newsletter for Lottery ...

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A 3D Biofabricated Disease Model Mimicking the Brain Extracellular Matrix Suitable to Characterize Intrinsic Neuronal Network Alterations in the Presence of a Breast Tumor Disseminated to the Brain

Advanced Functional Materials, EarlyView.
A 3D disease model is developed using customized hyaluronic‐acid‐based hydrogels supplemented with extracellular matrix (ECM) proteins resembling brain ECM properties. Neurons, astrocytes, and tumor cells are used to mimic the native brain surrounding.
Esra Türker, Mateo S. Andrade Mier, Jessica Faber, Mike Friedrich, Zan Lamberger, Jeannette Weigelt, Christian Stigloher, Nicoletta Murenu, Natascha Schaefer, Jörg Tessmar, Gregor Lang, Silvia Budday, Katrin G. Heinze, Antje Appelt‐Menzel, Pamela L. Strissel, Reiner Strick, Carmen Villmann   +16 more
wiley   +1 more source

Advances in 3D Printed Electronics: Materials, Processes, Properties and Applications. [PDF]

Materials (Basel), 2023
Tang H, Xiao X.
europepmc   +1 more source

Three-dimensional modular electronic interconnection system [PDF]

, 2001
A three-dimensional connection system uses a plurality of printed wiring boards with connectors completely around the printed wiring boards, and connected by an elastomeric interface connector.
Bolotin, Gary S., Cardone, John
core   +1 more source

Ice Lithography: Recent Progress Opens a New Frontier of Opportunities

Advanced Functional Materials, EarlyView.
This review focuses on recent advancements in ice lithography, including breakthroughs in compatible precursors and substrates, processes and applications, hardware, and digital methods. Moreover, it offers a roadmap to uncover innovation opportunities for ice lithography in fields such as biological, nanoengineering and microsystems, biophysics and ...
Bingdong Chang, Gwendoline A. E. Anand, Rubaiyet Haque, Dylan A. Chiaro, Mona Sharma, Andrew R. Williams, Frank Niklaus, Daryl W. Yee, Gavin M. King, Anpan Han   +9 more
wiley   +1 more source

A Review on Sustainable Inks for Printed Electronics: Materials for Conductive, Dielectric and Piezoelectric Sustainable Inks. [PDF]

Materials (Basel), 2023
Sanchez-Duenas L, Gomez E, Larrañaga M, Blanco M, Goitandia AM, Aranzabe E, Vilas-Vilela JL.   +6 more
europepmc   +1 more source

Expanding Chemical Space of Nucleic Acid Nanoparticles for Tunable Antiviral‐Like Immunomodulatory Responses and Potent Adjuvant Activity

Advanced Functional Materials, EarlyView.
We introduce a nucleic acid nanoparticle (NANP) platform designed to be rrecognized by the human innate immune system in a regulated manner. By changing chemical composition while maintaining constant architectural parameters, we identify key determinants of immunorecognition enabling the rational design of NANPs with tunable immune activation profiles
Martin Panigaj, Hannah S. Newton, Jian Wang, Laxmi Pandey, Yelixza I. Avilla, Phong Nguyen, Morgan Chandler, Justin Halman, Yasmine Radwan, Stephanie Smith, Elijah Edmondson, Simone Difilippantonio, Chelsea Sanders, Bao Tran, Yongmei Zhao, Shaojun Xie, Edward Cedrone, Barry W. Neun, Meni Wanunu, Nikolay V. Dokholyan, Marina A. Dobrovolskaia, Kirill A. Afonin   +21 more
wiley   +1 more source

Electrochemical biosensors and power supplies for wearable health‐managing textile systems

Interdisciplinary Materials
In recent years, wearable electrochemical biosensors have received increasing attention, benefiting from the growing demand for continuous monitoring for personalized medicine and point‐of‐care medical assistance. Incorporating electrochemical biosensing
Changxin Li, Kangkang Jia, Qimin Liang, Yingchun Li, Sisi He   +4 more
doaj   +1 more source

A Comprehensive Review on Printed Electronics: A Technology Drift towards a Sustainable Future. [PDF]

Nanomaterials (Basel), 2022
Chandrasekaran S, Jayakumar A, Jayakumar A, Velu R.   +3 more
europepmc   +1 more source

An application protocol for CAD to CAD transfer of electronic information [PDF]

The exchange of Computer Aided Design (CAD) information between dissimilar CAD systems is a problem. This is especially true for transferring electronics CAD information such as multi-chip module (MCM), hybrid microcircuit assembly (HMA), and printed ...
Azu, Charles C., Jr.
core   +1 more source