Results 171 to 180 of about 1,099,904 (385)
Carbon Nanotube 3D Integrated Circuits: From Design to Applications
Advanced Functional Materials, EarlyView.As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu +3 more
wiley +1 more source
Chip integration using inkjet-printed silver conductive tracks reinforced by electroless plating for flexible board packages [PDF]
, 2012 International audienceInkjet-printing of interconnects is a maskless technology that has attracted great interest for printed electronics and packaging applications. Gemalto is expecting by motivated and developing skills and knowledge in this area to be
Cauchois, Romain +6 more
core +1 more source
Advanced Functional Materials, EarlyView.Geometric multi‐bit patterning based on dynamic wetting and dewetting phenomena creates roulette‐like Physical Unclonable Function (PUF) labels with stochastic yet deterministic properties. This method leverages the solutal‐Marangoni effect for high randomness while achieving deterministic multinary patterns through polygonal confinement of binary ...
Yeongin Cho +8 more
wiley +1 more source
High conductivity Sepia melanin ink films for environmentally benign printed electronics. [PDF]
Proc Natl Acad Sci U S A, 2022 Camus A +5 more
europepmc +1 more source
Advanced Functional Materials, EarlyView.This study demonstrates the use of a low‐cost 3D printing technique to prepare a large‐area PVDF‐FAPbI3 composite dielectric film for flexible TENG application. The δ→α phase transformation of the FAPbI3 nanofillers has significantly improved the β‐phase content, morphology, and dielectric properties of the PVDF film.
Nurfatin Hafizah Zain Karimy +7 more
wiley +1 more source
An Automated Room Temperature Flip-Chip Mounting Process for Hybrid Printed Electronics. [PDF]
Micromachines (Basel), 2022 Chen Z +6 more
europepmc +1 more source
, 2014 This paper reports an improvement in dielectric and piezoelectric properties of screen-printed PZT/polymer films for flexible electronics applications using Cold Isostatic Pressing (CIP).
Almusallam, Ahmed +5 more
core +1 more source
Cell Membrane Vesicle Camouflaged Artificial Cells
Advanced Functional Materials, EarlyView.Artificial cells camouflaged with a cell membrane vesicle coating are able to assemble into synthetic aggregates that exhibit rudimentary communication capabilities. Additionally, when these artificial cells are equipped with antioxidant capabilities, they are able to protect the intracellular homeostasis in HepG2 cells present in semi‐synthetic ...
Paula De Dios Andres +11 more
wiley +1 more source
Structured, Shaped, or Printed Single‐Atom Catalysts and Their Applications
Advanced Functional Materials, EarlyView.This paper reviews the design and use of structured single‐atom catalysts, which integrate porous architectures with the exceptional reactivity of isolated catalytic sites. It explores fabrication strategies, advanced characterization methods, and support materials that enhance thermal stability, mechanical robustness, and operational efficiency of ...
Jiachengjun Luo +4 more
wiley +1 more source
Electrochemical biosensors and power supplies for wearable health‐managing textile systems
Interdisciplinary MaterialsIn recent years, wearable electrochemical biosensors have received increasing attention, benefiting from the growing demand for continuous monitoring for personalized medicine and point‐of‐care medical assistance. Incorporating electrochemical biosensing
Changxin Li +4 more
doaj +1 more source