Results 51 to 60 of about 5,157,617 (274)

Entropy‐Driven Design of Low‐Melting‐Point Alloys via Compositionally Complex Strategy

open access: yesAdvanced Engineering Materials, EarlyView.
Conventional low‐melting‐point alloys (LMPAs) are limited by a narrow compositional space and inherent property trade‐offs. This review presents an entropy‐driven design strategy that overcomes these limitations, ushering in a new class of low‐melting‐point compositionally complex alloys (LMCCAs).
Yinghui Shang   +6 more
wiley   +1 more source

Recent Progress and Challenges of Flexible Zn-Based Batteries with Polymer Electrolyte

open access: yesBatteries, 2022
Zn-based batteries have been identified as promising candidates for flexible and wearable batteries because of their merits of intrinsic safety, eco-efficiency, high capacity and cost-effectiveness.
Funian Mo   +6 more
doaj   +1 more source

Potential up-scaling of inkjet-printed devices for logical circuits in flexible electronics [PDF]

open access: yes, 2015
Inkjet Technology is often mis-believed to be a deposition/patterning technology which is not meant for high fabrication throughput in the field of printed and flexible electronics.
Martinez-Domingo, Carme   +13 more
core   +1 more source

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

open access: yesAdvanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw   +3 more
wiley   +1 more source

Leveraging Symbolic Artificial Intelligence and Fuzzy Logic for Materials Science: A Review of Methods, Challenges, and Applications to Scarce and Imperfect Experimental Data

open access: yesAdvanced Engineering Materials, EarlyView.
This article explores the transformative potential of symbolic artificial intelligence (AI) in the field of materials science, particularly in leveraging experimental data. The article presents several symbolic AI models and discusses their applications in materials science.
Ahmed Amrani   +7 more
wiley   +1 more source

Advances in mRNA nanomedicines for malignant brain tumor therapy

open access: yesSmart Materials in Medicine, 2023
Nowadays, malignant brain tumors are still mostly lethal diseases with poor prognosis and a clinical median survival rate of fewer than 2 years after therapeutic intervention.
Ting Deng   +5 more
doaj   +1 more source

Enhanced stretchable electronics made by fused-filament fabrication

open access: yes, 2020
3D printing is widely used for manufacturing complex non-functional parts, and recently, the fabrication of electronics has also attracted research attention.
Salo, Teemu   +3 more
core   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

Large-area printed organic electronic ion pumps

open access: yes, 2019
Biological systems use a large variety of ions and molecules of different sizes for signaling. Precise electronic regulation of biological systems therefore requires an interface which translates the electronic signals into chemically specific biological
Berggren, Magnus,   +16 more
core   +1 more source

Materials‐Driven Additive Manufacturing for Electrical Machines: Qualification‐Oriented Design Beyond Geometric Freedom

open access: yesAdvanced Engineering Materials, EarlyView.
This perspective reframes additive manufacturing for electrical machines as a qualification‐limited materials and architecture design problem. It links process–structure–property–performance relationships to magnetic, conducting, dielectric, and thermal property windows, highlighting where AM can enable segmented magnetic circuits, permanent magnet ...
Dénes Fodor, Loránd Szabó
wiley   +1 more source

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