Results 141 to 150 of about 1,757,856 (287)

Microstructure Modification of Additively Manufactured Mo–9Si–8B by Annealing and Its Effects on High‐Temperature Mechanical Properties

open access: yesAdvanced Engineering Materials, EarlyView.
Postbuild annealing systematically modifies the phase fractions and morphology of EB‐PBF processed Mo–9Si–8B. Quantitative microstructure–property correlations reveal how controlled phase evolution enhances high‐temperature compressive strength and creep resistance.
Christopher Schmidt   +5 more
wiley   +1 more source

Decision Making by Hybrid Probabilistic - Possibilistic Utility Theory [PDF]

open access: yes
It is presented an approach to decision theory based upon nonprobabilistic uncertainty. There is an axiomatization of the hybrid probabilisticpossibilistic mixtures based on a pair of triangular conorm and triangular norm satisfying restricted ...
Endre Pap
core  

Controlling Grain Growth in Powder Bed Fusion of Yttria‐Stabilized Zirconia Using Femtosecond Lasers: Challenges and Methodological Insights

open access: yesAdvanced Engineering Materials, EarlyView.
Binder‐free laser powder bed fusion of 8YSZ with a femtosecond laser is used to map process windows linking scan strategy, heat accumulation, and grain growth. Time‐resolved thermography and simulations reveal thermal regimes that enable continuous, vitrified, and fine‐grained 8YSZ surface layers without absorptive additives and demonstrate ...
Markus Kühn   +5 more
wiley   +1 more source

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

open access: yesAdvanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz   +4 more
wiley   +1 more source

Gallium Microalloying in Bi–Sn Solders: Interfacial Phase Formation, Wettability, and Long‐Term Shear Reliability Under Isothermal Aging

open access: yesAdvanced Engineering Materials, EarlyView.
Gallium microalloying redirects interfacial reactions in low‐temperature Bi–Sn solders from Cu–Sn toward Cu–Ga intermetallic formation. The resulting Cu–Ga layer suppresses intermetallic growth during thermal aging, alters fracture pathways, and improves interfacial stability.
Iva Králová   +6 more
wiley   +1 more source

A Novel Approach to Estimate the Transition Temperature via Dynamic Nanoindentation

open access: yesAdvanced Engineering Materials, EarlyView.
A new dynamic nanoindentation‐based method was developed that uses the stiffness ratio as an indicator of the elastic–plastic deformation contributions at different temperatures. The approach successfully identified transition temperatures in ferritic steel and distinguished them from continuously ductile austenitic steel.
Stefan Zeiler   +4 more
wiley   +1 more source

CFP Theorems in Function-Weighted Probabilistic Metric Spaces and Integral and Fourth-Order Differential Equations

open access: yesJournal of Mathematics
This paper develops the theory of function-weighted probabilistic metric spaces (FWPMSs) and establishes the existence of common fixed points (CFPs) for commutative mappings within this framework.
Ehsan Lotfali Ghasab   +2 more
doaj   +1 more source

Enhancement of the Through‐Thickness Electrical Conductivity of Carbon‐Fiber‐Reinforced Plastics Using Large Graphite Particles

open access: yesAdvanced Engineering Materials, EarlyView.
To enhance through‐thickness conductivity without sacrificing impregnation, large spherical graphite particles are intentionally employed in a low‐viscosity resin. Unlike finer conductive fillers, these particles remain outside the fiber bundles and accumulate in resin‐rich interlaminar regions during molding.
Keito Hosoe   +6 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

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