Results 141 to 150 of about 169,778 (281)

Evaluation Strategies of Hil48 Yield Criterion in Application: Toward Sufficient and Necessary Conditions for Prediction of Plastic Anisotropy

open access: yesAdvanced Engineering Materials, EarlyView.
This article presents a comprehensive analysis of the intrinsic relationships and applicability of Hill48 yield criterion. The applicability and error evaluation conditions for Hill48 are established based on specific experimental data. A parameter calibration strategy for N‐value based on error minimization is proposed, and the predictive accuracy is ...
Jinxin Wang   +9 more
wiley   +1 more source

Laser Remelting of a CrMnFeCoNi High‐Entropy Alloy: Effect of Energy Density on Elemental Segregation

open access: yesAdvanced Engineering Materials, EarlyView.
Laser remelting of a CrMnFeCoNi high‐entropy alloy reveals that optimal chemical homogenization occurs between 30 and 40 J·mm−2. Within this range, elemental segregation is reduced by over 30% compared to the as‐cast state. The study establishes this window as a fast, effective alternative to prolonged annealing for achieving uniform elemental ...
Ajay Talbot   +5 more
wiley   +1 more source

Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets

open access: yesAdvanced Engineering Materials, EarlyView.
Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian   +5 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

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