Results 141 to 150 of about 169,778 (281)
Projective differential geometry of curved surfaces. III [PDF]
E. J. Wilczynski
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This article presents a comprehensive analysis of the intrinsic relationships and applicability of Hill48 yield criterion. The applicability and error evaluation conditions for Hill48 are established based on specific experimental data. A parameter calibration strategy for N‐value based on error minimization is proposed, and the predictive accuracy is ...
Jinxin Wang+9 more
wiley +1 more source
Stationary Veselov-Novikov equation and isothermally asymptotic surfaces in projective differential geometry [PDF]
E. Ferapontov
semanticscholar +1 more source
Laser remelting of a CrMnFeCoNi high‐entropy alloy reveals that optimal chemical homogenization occurs between 30 and 40 J·mm−2. Within this range, elemental segregation is reduced by over 30% compared to the as‐cast state. The study establishes this window as a fast, effective alternative to prolonged annealing for achieving uniform elemental ...
Ajay Talbot+5 more
wiley +1 more source
Projective differential geometry of correspondences between two spaces. II [PDF]
Eduard Čech
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Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets
Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian+5 more
wiley +1 more source
On the Dimensions of Hermitian Subfield Subcodes from Higher-Degree Places. [PDF]
El Khalfaoui S, Nagy GP.
europepmc +1 more source
Multiple Cycle Slip Detection Algorithm for a Single Frequency Receiver. [PDF]
Yoon YM, Lee BS, Heo MB.
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Projective differential geometry of correspondences between two spaces. I [PDF]
Eduard Čech
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Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke+3 more
wiley +1 more source