Results 271 to 280 of about 1,218,885 (321)
Fourth-order kinematic analysis: Advanced decomposition methods for particle motion in modified orthogonal frame. [PDF]
Alghamdi F, Elsharkawy A.
europepmc +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Orthoplastic tarsal reconstruction using a chimeric vascularized bone graft in a heavy smoker: a case report. [PDF]
Potocnik P +3 more
europepmc +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source
Dual Reconstruction, Combined Anterior Latissimus Dorsi with Teres Major and Middle Trapezius Tendon Transfer, Reduces Anterior Superior Humeral Subluxation: Case Report. [PDF]
Baek CH, Kim BT, Kim JG, Lim CM.
europepmc +1 more source
This critical review presents a comprehensive roadmap for the precision 3D printing of cellulose. Quantitative correlations link ink formulation and rheological properties to print fidelity and final material performance. This framework guides the development of advanced functional materials, from biomedical scaffolds to electromagnetic shielding ...
Majed Amini +3 more
wiley +1 more source

