Results 181 to 190 of about 8,346,626 (381)
Barriers and facilitators of public transport use among people with disabilities: a scoping review. [PDF]
Mwaka CR+4 more
europepmc +1 more source
This study explores the energy conversion in powder bed fusion of polymers using laser beam for polyamide 12 and polypropylene powders. It combines material and process data, using dimensionless parameters and numerical models, to enable the prediction of suitable printing parameters.
Christian Schlör+9 more
wiley +1 more source
MEASURES TO ENHANCE PERSONAL SECURITY IN PUBLIC TRANSPORT
The paper presents some detail the public's preferred measures for greater safety when travelling, and drew on their experience of measures taken by transport operators and others to enhance personal security in public transport.
Ivana Olivková
doaj
Pratiques syndicales, racisme et antiracisme à propos d'une recherche en cours dans une entreprise de transports publics [PDF]
Christian Rinaudo, Philippe Poutignat
openalex +1 more source
The fused filament‐fabricated MAR‐M247 alloy without hot isostatic pressing shows the lowest porosity of 4%. Heat treatment at 1220 °C produces coarse precipitates and carbides. Specimens heat‐treated at 1220 °C exhibit higher tensile strength (683 MPa) and elongation (10%) at room temperature.
Haneen Daoud+7 more
wiley +1 more source
A multifunctional hydroxyapatite (HAp) coating integrated with silver‐gallium liquid metal nanoparticles (HAp‐Ag‐GaNPs) exhibits dual antibacterial and osteogenic properties. It effectively inhibits Gram‐positive and Gram‐negative bacteria, including resistant strains, while enhancing bone regeneration.
Ngoc Huu Nguyen+17 more
wiley +1 more source
Carbon Nanotube 3D Integrated Circuits: From Design to Applications
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu+3 more
wiley +1 more source