Results 231 to 240 of about 8,152,883 (248)

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Coatings, 2022
The uniformity and microstructure of the copper deposition in the high aspect ratio plated through holes (penetrating holes) are crucial for the performance of printed circuit board.
Yifan Dong, Wensheng Li, Wen Ge
exaly   +2 more sources

Pulse and pulse reverse plating—Conceptual, advantages and applications

Electrochimica Acta, 2008
A review on pulse and pulse reverse techniques for electrodeposition have been attempted. Pulse electrodeposition (PED) of some metals and alloys are reported.
Malathy Pushpavanam
exaly   +1 more source

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Features of pulse-reverse modes for Ni–Fe nanogranular films electrodeposition: Correlation of structural parameters and MI effect

Ceramics International, 2023
Alex V Trukhanov, Vladimir Fedkin, Anna Kotelnikova   +2 more
exaly  

Modulating the active sites of nickel phosphorous by pulse-reverse electrodeposition for improving electrochemical water splitting

Applied Catalysis B: Environmental, 2022
Jae Jeong Kim, Myung Jun Kim
exaly  

The effects of pulse–reverse parameters on the properties of Ni–carbon nanotubes composite coatings

Surface and Coatings Technology, 2007
Yu Zuo, Xiong Jinping
exaly  

Pulse-reverse electrodeposition of Pt–Co bimetallic catalysts for oxygen reduction reaction in acidic medium

International Journal of Hydrogen Energy, 2020
Arunachala Nadar Mada Kannan, Nisit Tantavichet   +1 more
exaly  

Effect of reverse pulse time on electrodeposited Ni-W coatings

Surface and Coatings Technology, 2017
Hongbo Cong, Devesh Dadhich Shreeram, Vikram Bedekar   +2 more
exaly  

Formation of Co–Ni alloy coatings under direct current, pulse current and pulse-reverse plating conditions

Electrochimica Acta, 2012
Jorge Vazquez-Arenas, Mark Pritzker
exaly  

Effects of duty cycle on properties of CIGS thin films fabricated by pulse-reverse electrodeposition technique

Applied Surface Science, 2013
Chan-Jin Park, Harsharaj Jadhav, SeJin Ahn   +2 more
exaly  

Pulse and pulse reverse plating of copper from acid sulphate solutions

Transactions of the Institute of Metal Finishing, 2010
Peter Leisner, I Belov
exaly