Results 171 to 180 of about 102,453 (286)

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Dynamic patterns of gene expression match extracellular signals through push-pull regulation. [PDF]

open access: yesPLoS Genet
Montano-Gutierrez LF   +5 more
europepmc   +1 more source

Fabrication Technologies for Soft, Multimaterial Optical Fibers for In Vivo Diagnostics and Phototherapy, With a Focus on Extrusion Printing

open access: yesAdvanced Materials Technologies, EarlyView.
Soft multimaterial optical fibers integrate multiple functionalities—such as waveguiding, side emission, sensing, drug delivery or actuation—into a single filament for wearable, implantable, and tissue‐integrated devices for diagnostics and phototherapy.
Zahra Kafrashian   +2 more
wiley   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack   +15 more
wiley   +1 more source

Advances in Solid‐Phase Processing Techniques: Innovations, Applications, and Future Perspectives

open access: yesAdvanced Materials Technologies, EarlyView.
Based on practical manufacturing challenges, this review examines advanced solid‐phase processing techniques that overcome the inherent limitations of conventional melting‐based and traditional solid‐phase manufacturing, enabling the production of higher‐performance components at reduced cost through process innovation and improved supply‐chain ...
Tianhao Wang
wiley   +1 more source

Ultra‐Thin Soft Pneumatic Actuation for Minimally Invasive Neural Interfacing

open access: yesAdvanced Materials Technologies, EarlyView.
Parylene C is a common polymer in bioelectronics, favored for its biological and chemical inertness. However, this makes bonding layers of Parylene C together very challenging. Here it is a laser to selectively weld layers of Parylene C to create high‐pressure fluidic actuation devices.
Lawrence Coles   +4 more
wiley   +1 more source

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