Results 201 to 210 of about 24,877 (251)
Visualizing Metal Nanoparticle Electrochemical Dissolution Atom by Atom. [PDF]
Zhao P +3 more
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Influence of Chloride Ions on Corrosion Mechanism of Pipeline Steel in Bicarbonate Alkaline Environments. [PDF]
Liu D +6 more
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Electrochemical discharge etching of porous tungsten emitters for field emission electric propulsion applications. [PDF]
Seo WG, Kuk JW, Kim H, Kang D, Huh J.
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Electrochemical Determination of Dissolution Rates of Lyophilized Pharmaceutical Formulations
Analytical Chemistry, 2001We present a method to measure dissolution times for rapidly dissolving lyophilized formulations. K4Fe(CN)6 was lyophilized in formulations containing sucrose, salts, and Tween 20. Dissolution of the lyophilized powders was measured by monitoring the time dependence of the oxidation of Fe(CN)6(4-) ion at the surface of a platinum rotating disk ...
S D, Webb +3 more
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Surface Engineering and Applied Electrochemistry, 2010
By the example of dissolution under conditions of controlled hydrodynamics (a rotating disk electrode), the distinctions of the surface formation after the anodic dissolution of electrolytic chromium films in electrolytes for electrochemical machining (ECM) (in chlorides and nitrates at current densities of 0.1–15 A/cm2) have been shown.
S. A. Silkin +2 more
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By the example of dissolution under conditions of controlled hydrodynamics (a rotating disk electrode), the distinctions of the surface formation after the anodic dissolution of electrolytic chromium films in electrolytes for electrochemical machining (ECM) (in chlorides and nitrates at current densities of 0.1–15 A/cm2) have been shown.
S. A. Silkin +2 more
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Nanoparticle Size Effects on the Electrochemical Dissolution Rate of Pt
ECS Meeting Abstracts, 2009Abstract not Available.
Ronald S. Goeke +3 more
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Removal Rate Simulation of Dissolution-Type Electrochemical Mechanical Polishing
Japanese Journal of Applied Physics, 2010A new method for simulating the Cu removal rate in electrochemical mechanical polishing (ECMP) based on the dissolution-type polishing mechanism was developed. The effect of a protective layer on the Cu removal rate was considered in this method because the protective layer is a key element in the dissolution-type polishing mechanism.
Akira Fukuda +7 more
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Controlling the Electrochemical Response of Magnesium Alloys for Customized Bio-Dissolution Rates
ECS Meeting Abstracts, 2011Abstract not Available.
N.T. Kirkland +6 more
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