Results 211 to 220 of about 163,783 (293)

Compliant Die Attach Process for High‐Conformity Integration of Ultra‐Thin Chips on Curved Surfaces

open access: yesAdvanced Materials Technologies, EarlyView.
A compliant die attach process is developed for bonding ultra‐thin silicon dies onto high‐curvature surfaces. Using FEM‐guided tool design and process optimization, the method achieves excellent surface conformity and minimal voids. This approach offers a reliable solution for next‐generation curved electronics, including LiDAR and wide field‐of‐view ...
Hakyung Jeong   +9 more
wiley   +1 more source

A High‐Throughput AngioPlate Platform with Integrated AngioTEER for Modeling and Monitoring Renal Proximal Tubule Injury

open access: yesAdvanced Materials Technologies, EarlyView.
Renal tubular injury is a major contributor to kidney disease, yet remains poorly understood due to the lack of predictive models. This study presents a high‐throughput 3D renal proximal tubule model on the AngioPlate platform integrated with automated TEER measurements (AngioTEER), enabling real‐time monitoring of drug‐induced nephrotoxicity ...
Shravanthi Rajasekar   +13 more
wiley   +1 more source

Advanced Materials in Responsible Electronics: Innovations for Sustainability, Health, and Circularity

open access: yesAdvanced Materials Technologies, EarlyView.
Contemporary electronic devices produce significant waste, harming ecosystems. Innovation in design, consumption, materials, and end‐of‐life management is crucial. This review explores advanced materials for sustainable and responsible electronics, highlighting their potential to reduce environmental and health hazards while improving device ...
Rawan Omar   +7 more
wiley   +1 more source

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