Results 231 to 240 of about 2,008,811 (296)

High Throughput Aerosol Jet Printing to Operationalize High Aspect Ratio Patterning

open access: yesAdvanced Materials Technologies, EarlyView.
High‐throughput aerosol jet printing poses distinct limiting mechanisms to the printing process. These include rapidly changing ink chemistries, atomization instabilities, and liquid‐phase spreading. The combination of in‐line heating, process monitoring, and traditional optimization procedures enables rapid printing of high‐aspect‐ratio structures ...
Bella I. Guyll   +4 more
wiley   +1 more source

3D Printed Photon Shield Assembly for Low‐Noise Visual Stimulation During Two‐Photon Imaging in Mice

open access: yesAdvanced Materials Technologies, EarlyView.
We present the Photon Shield, an open‐hardware system for low‐noise two‐photon calcium imaging during visual stimulation in mice. Combining a 3D‐printed headplate and rail‐mounted shield substantially reduces stray‐light contamination, as quantitatively verified. Functional validation confirms reliable cortical responses. Open design files enable broad
Gergely Katona   +6 more
wiley   +1 more source

Toward Perception‐Native Electronic Skin: Bio‐Inspired In‐/Near‐Sensor and Neuromorphic Computing for Humanoid Robots

open access: yesAdvanced Materials Technologies, EarlyView.
Dense tactile streams from across the humanoid body converge on collide in a central wiring and data bottleneck. By relocating computation closer to and then into the skin itself, near‐ and in‐sensor architectures, together with neuromorphic computing, chart a path toward perception‐native electronic skin, in which the conversion of stimulus into ...
Mijin Kim   +6 more
wiley   +1 more source

Neutrophil Extracellular Traps in Central Nervous System Diseases. [PDF]

open access: yesCurr Neuropharmacol
Zhu J, Zhu H, Hou W, Liu JY.
europepmc   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

Microscale 3D‐Printed Digital Strain Switches for Embedded Mechanical Computation

open access: yesAdvanced Materials Technologies, EarlyView.
Microscale 3D‐printed strain switches on flexible films convert deformation into native digital signals at geometry defined thresholds. A closed form model predicts switching from 3000 to 15 000 microstrain and is validated across 110 devices. Reliable ohmic closure and strain activated AND, OR, and XOR logic point toward low‐power mechanical ...
Regan Kubicek   +3 more
wiley   +1 more source

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