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Multi‐Material Gradient Printing Using Meniscus‐enabled Projection Stereolithography (MAPS)

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
MAPS is a new vat‐free printing technique that utilizes programmed delivery of resin droplets with custom formulations to enable multi‐material gradient printing of 3D structures with user‐defined variations in mechanical stiffness, opacity, surface energy, cell densities, and magnetic properties. Abstract Light‐based additive manufacturing methods are
Puskal Kunwar   +10 more
wiley   +1 more source

Controlled Ecological Life Support System: Use of Higher Plants [PDF]

open access: yes
Results of two workshops concerning the use of higher plants in Controlled Ecological Life Support Systems (CELSS) are summarized. Criteria for plant selection were identified from these categories: food production, nutrition, oxygen production and ...
Alford, D. K., Tibbits, T. W.
core   +1 more source

3D Printing of Highly Electrically Conductive Zinc for Sustainable Electronics Applications

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
A 3D printable zinc ink system with active zinc particles in a shellac matrix is demonstrated. The results show high conductivity, stable performance of printed structures under varying humidity conditions, and promising application in disposable water‐activated batteries. This technology combining digital material assembly, reliable operation, and non‐
Xavier Aeby   +5 more
wiley   +1 more source

Recycling of manganese ore waste [PDF]

open access: yes, 2017
Berezniak, Oleksandr   +2 more
core  

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

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