Cooperative Effect of Ammonium Polyphosphate and Talcum for Enhancing Fire-Proofing Performance of Silicone Rubber-Based Insulators via Formation of a HIGH-Strength Barrier Layer. [PDF]
Zhao D, Jiang Y, Fang Y, Wang T, Shen Y.
europepmc +1 more source
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
wiley +1 more source
Laser-driven luminescent ceramic-converted near-infrared II light source for advanced imaging and detection techniques. [PDF]
Gu S +6 more
europepmc +1 more source
Defect‐Healed Au/rGO Coating for the Corrosion Protection of PEMFC Bipolar Plates
A defect‐healed gold/reduced graphene oxide (Au/rGO) coating is presented for stainless steel bipolar plates in polymer electrolyte membrane fuel cells. Gold nanoparticles nucleate at graphene oxide defects, blocking corrosive ion penetration and enhancing corrosion resistance, thereby ensuring durable fuel cell operation.
Jinmyeong Seo +6 more
wiley +1 more source
An 18-Month Randomized Controlled Clinical Trial Evaluating the Clinical Success of IPS e.max Conventional Crowns and Endocrowns in Extensively Restored Molars. [PDF]
Dalol RE, Abou Nassar JN, Hajeer MY.
europepmc +1 more source
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya +2 more
wiley +1 more source
Evaluation of the Effect of Saudi Coffee Consumption in Comparison to Various Types of Coffees on the Color of Novel Aesthetic Dental Ceramics. [PDF]
Alrabeah GO +4 more
europepmc +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source

