Results 341 to 350 of about 190,755 (383)
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Reliability assurance of individual semiconductor components
Proceedings of the IEEE, 1974Where small numbers of highly reliable semiconductor devices are required, conventional methods of procurement are found to have deficiencies. An approach to procurement is proposed which is cost effective, accommodates new device types, and assures reliability in the individual device.
D.V. Sulway +2 more
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Reliability Of Ingaasp Semiconductor Lasers
SPIE Proceedings, 1987The degradation mechanisms and reliability assurance strategies of InGaAsP semiconductor lasers that are currently being used in many commercial lightwave systems are discussed.
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Reliability assessment of power semiconductor devices
2016 19th International Symposium on Electrical Apparatus and Technologies (SIELA), 2016This paper concerns some issues related to failures that occurred in power semiconductor devices. A review of basic requirements aimed at normal and reliable operation of semiconductor components is done by using reliability prediction approaches and prognostic methods.
Nikolay Nikolov +2 more
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Reliability Evaluation and Prediction for Discrete Semiconductors
IEEE Transactions on Reliability, 1980The use of accelerated step-stress and constant stress-in-time test techniques is demonstrated for generating models for predicting reliability at use conditions. Reliability prediction models were obtained for a signal diode, signal and power transistors, silicon trolled rectifier, and metal oxide varistor.
A. Poe, Erwin A. Herr, A. Fox
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Reliability test for subsea power semiconductors
Microelectronics Reliability, 2020Abstract Following the demand from a new domain of application, a test setup was developed to evaluate the performance of high-power semiconductor device when exposed to a dielectric liquid and high pressure. The specific test conditions were established to emulate the conditions inside a tank place in a deep-sea environment.
David Guillon +4 more
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Who Wants Reliable Plastic Semiconductors?
11th Reliability Physics Symposium, 1973It has been found that a tri-layer metal contact system, consisting of platinum silicide-titanium-platinum-gold, is at least a factor of five better than a comparable aluminum metalized device with respect to humidity. However, all gold metalized devices are not necessarily this good; an example is given.
G. Malinowski +2 more
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The reliability of semiconductor devices in the bell system
Proceedings of the IEEE, 1974The history of reliability of semiconductor devices in the Bell System is a story of sequential application of principles-first, of reliability-enhancing processing principles, which are applied in the absence of completely knowledgeable design and testing control; second, of testing-control principles, which follow growing knowledge of process defects
D.S. Peck, C.H. Zierdt
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Metallization Reliability and Defectivity in Compound Semiconductors
ECS Meeting Abstracts, 2015Compound semiconductor devices are in mass volume production yet our understanding of reliability and defectivity of III-V materials is still evolving. Process-induced defects in electroplated Au interconnect metallization on GaAs devices were detected during the course of reliability testing.
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Reliability of semiconductor devices - The need for simulation
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, 2011Reliability requirements for semiconductor devices have increased tremendously in the past years. However, product qualification is still dominated by standard stress test procedures. Despite improved approaches that have entered the discussion recently, testing alone will not suffice to prove very low failure rates.
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Reliability Testing of Semiconductor Devices in a Humid Environment
Journal of the IEST, 1993The influence of humidity on semiconductor device reliability is investigated with two main purposes: to emphasize the role of humidity in the failure process as a stress factor and to model the reliability-humidity relationship. Experiments were performed on two types of plastic encapsulated semiconductor devices (optoelectronic and ICs).
Marius Bazu, Mihai Tazlauanu
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