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Silver Paste Transferability During Imprinting Using PDMS Replica Mold
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)The minimum pitch for flip-chip bonding is limited by the difference in the thermal expansion coefficient between the chip and substrate, which is approximately 40 microns when solder is used for the bumps. This problem can be greatly alleviated by using
H. Komatsu, D. Sakai, N. Shimoishizaka
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Replica Mold for Nanoimprint Lithography from a Novel Hybrid Resin
Langmuir, 2009The use of durable replica molds with high feature resolution has been proposed as an inexpensive and convenient route for manufacturing nanostructured materials. A simple and fast duplication method, involving the use of a master mold to create durable polymer replicas as imprinting molds, has been demonstrated using both UV- and thermal ...
Lee, BK +4 more
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Fabrication of Hierarchical 3D PDMS Molds by Replica Molding from Diatom Frustules
This study presents a method to fabricate polydimethylsiloxane (PDMS) molds with hierarchical 3D structures by using the centric diatom, Coscinodiscus sp., as templates. The diatom frustules were immobilized on Si wafer, followed by casting the diluted PDMS on the substrate.
Mengjiao Wang, Jun Cai, Zhenhu Wang
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ACS Applied Materials and Interfaces, 2023
Controlling the surface wetting properties of channels is crucial to the robust and reliable performance of microfluidic devices. Spatially patterned hydrophobic/hydrophilic microchannels have found utility across various applications, notably in the ...
Jingyu Wu, D. Issadore, Daeyeon Lee
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Controlling the surface wetting properties of channels is crucial to the robust and reliable performance of microfluidic devices. Spatially patterned hydrophobic/hydrophilic microchannels have found utility across various applications, notably in the ...
Jingyu Wu, D. Issadore, Daeyeon Lee
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Adam Gołąb +5 more
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On Pattern Transfer in Replica Molding
Langmuir, 2008Nano- and micromolding of elastic materials produces smoothed replicas of the mold structures. This limits the technique's resolution. Here we identified surface tension as the cause of smoothing and derived explicit equations for calculating molded feature shapes.
Ovidiu D, Gordan +6 more
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Microelectronic Engineering, 2018
Ultraviolet nanoimprint lithography provides a high-throughput and cost-effective method to fabricate nanopatterns. However, the master mold deteriorates owing to the adhesion of resin and the occurrence of defects.
Junpei Tsuchiya, S. Hiwasa, J. Taniguchi
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Ultraviolet nanoimprint lithography provides a high-throughput and cost-effective method to fabricate nanopatterns. However, the master mold deteriorates owing to the adhesion of resin and the occurrence of defects.
Junpei Tsuchiya, S. Hiwasa, J. Taniguchi
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Parylene C coating for high-performance replica molding
Lab on a Chip, 2011This paper presents an improvement to the soft lithography fabrication process that uses chemical vapor deposition of poly(chloro-p-xylylene) (parylene C) to protect microfabricated masters and to improve the release of polymer devices following replica molding.
Kevin A, Heyries, Carl L, Hansen
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Replica molding for multilevel micro-/nanostructure replication
Journal of Micromechanics and Microengineering, 2010The development of micro- and nanofabrication processes with the capability to achieve three-dimensional structures is of great interest for a wide variety of applications. In this paper, a replica molding process for the replication of combined micro- and nanostructures in an epoxy-based photo resin is reported. First, multilevel masters were realized
T Senn +4 more
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