Results 121 to 130 of about 46,994 (285)
Logic-Based Conflict Analysis and Resolution [PDF]
, 2009 David Frieder Georg Lempp
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Advanced Materials Interfaces, EarlyView.This review summarizes the development of atomic force microscopy‐based local anodic oxidation technology for patterning 2D materials, discussing its mechanisms, applications in nanolithography and device fabrication, key influencing factors, existing challenges, and future prospects in nano‐designs.
Jing Yu +5 more
wiley +1 more source
High-Resolution CMOS Counter Type ADC Layout Design by using Transmission Gate Logic
, 2014 Lucky Prajapati +2 more
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Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Multiplicative linear logic from a resolution-based tile system
, 2022 Boris Eng, Thomas Seiller
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Advanced Optical Integration Processes for Photonic‐Integrated Circuit Packaging
Advanced Materials Technologies, EarlyView.Photonic integrated chip packaging is a growing technology that helps make devices faster, more efficient, and more compact by using light instead of electricity. This review highlights recent progress in making these chips work better at different levels, discusses current challenges like heat and alignment, and looks at future possibilities for ...
Keuntae Baek +4 more
wiley +1 more source
Resolution for Constrained Pseudo-Propositional Logic
, 2023 Ahmad-Saher Azizi-Sultan
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Advanced Materials Technologies, EarlyView.This paper contrasts electrospinning and 3D printing for porous membrane fabrication, evaluating their evolution, cost, resolution, mechanical traits, and scalability. While 3D printing excels in material diversity and industrial adaptability, electrospinning achieves finer resolution and thermal resilience.
Eya Kacem +6 more
wiley +1 more source
Coordination Logic for Repulsive Resolution Maneuvers [PDF]
, 2016 Anthony Narkawicz +2 more
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