Results 121 to 130 of about 49,509 (302)
Search Strategies for Resolution in CTL-Type Logics: Extension and Complexity [PDF]
Artie Basukoski, A. Bolotov
openalex +1 more source
Deep Learning Analysis of Solid‐Electrolyte Interphase Microstructures in Lithium‐Ion Batteries
A transformer‐based deep learning model is developed for segmenting and analyzing high‐resolution TEM images of the solid‐electrolyte interphase (SEI) in lithium‐ion batteries. The model is trained on DFT‐based simulated images and predicts SEI grain and grain boundaries, revealing key microstructural features that govern ion transport and degradation.
Ishraque Zaman Borshon +4 more
wiley +1 more source
Thermal Resistance of 1D Micron‐Wide Interface Under External Force Modulation
A novel TET‐based technique is developed to characterize the interfacial thermal resistance at the microscale. The interfacial thermal resistance is measured at ≈1200–1400 mK/W for natural contact. Externally applied force reduces the thermal resistance dramatically down to ≈125 mK/W.
Amin Karamati +3 more
wiley +1 more source
New Logics of Integration in European Security and Defence Policy: Change in Conflict-Resolution Mechanisms in the Intergovernmental Decision-Making Process [PDF]
Cesar Garcia Perez de Leon
openalex +1 more source
Halide Perovskite Memristor Crossbar Arrays for Low Voltage in Memory Computing
From early devices to centimeter‐scale crossbars, halide‐perovskite memristors now deliver ultra‐low‐energy, multilevel switching. Yet ion migration, device variability, and sneak currents hinder scaling. Advances in self‐rectifying junctions, nonlinear interfaces, bias maps, and hybrid oxides enhance array stability.
Hyojung Kim
wiley +1 more source
Completeness of (a#956;,a#957;)-Resolution Principle of Intuitionistic Operator Fuzzy Logic [PDF]
Hongliang Zheng, Benqiang Xu, Li Zou
openalex +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source
Logic-Based Conflict Analysis and Resolution [PDF]
David Frieder Georg Lempp
openalex +1 more source
Recent efforts of memristor array‐based hardware neuromorphic computing are discussed for efficient application of VMM on‐chip level in terms of circuit integration and actual application of AI algorithms. The parallel data processing principle of VMM operation is briefly reviewed, and hardware VMM is presented including convolutional transformation ...
Jingon Jang, Sang‐gyun Gi
wiley +1 more source

