Results 211 to 220 of about 552,325 (298)

Improving Surface Quality of Titanium Electrodeposition from a Deep Eutectic Solvent with Organic and Inorganic Additives

open access: yesAdvanced Engineering Materials, EarlyView.
Herein, the electroplating of titanium from an organic solvent, ethaline, is shown. Polymer additives are shown to smooth the roughness of the film, and small molecule additives are shown to produce a near‐mirror finish to the deposited metal. Titanium electroreduction is desired for a variety of medical, electronic, and bonding applications but has ...
Steven Livers   +7 more
wiley   +1 more source

The Structural Refinement of Commercial‐Purity Copper Processed by Equal Channel Angular Pressing with Low Strain Amplitude

open access: yesAdvanced Engineering Materials, EarlyView.
Equal channel angular pressing of commercial pure copper under low strain amplitude (≈0.48) induces concurrent continuous and localized discontinuous dynamic recrystallization, forming a duplex structure influenced by strain heterogeneity and recovery. Moderate hardening after 4–12 passes results from progressive high‐angle grain boundary formation via
Paula Cibely Alves Flausino   +6 more
wiley   +1 more source

Comparison of Root Coverage Procedure done with and without Loupes along with CGF-A Clinical Study.

open access: yesJ Pharm Bioallied Sci
Elangovan R   +5 more
europepmc   +1 more source

Soft Beats: A Dielectric Elastomer‐Based Ventricular Assist Device for Next‐Gen Heart Failure Management

open access: yesAdvanced Engineering Materials, EarlyView.
The dielectric elastomer‐based electropneumatic device (DE‐EPD) is a vacuum‐assisted ventricular assist device (VAD) that delivers high performance (85 mmHg, 6.8 L min−1) with low power consumption. Unlike traditional motor‐driven VADs, it is lightweight, quiet, energy‐efficient, and provides pulsatile flow. Validated in a simulated circulation system,
Amine Benouhiba   +6 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

Highly Stable Low‐Temperature Phosphate Glass as a Platform for Multimaterial 3D Printing of Integrated Functional Microfluidic Devices

open access: yesAdvanced Engineering Materials, EarlyView.
A highly stable, low‐temperature phosphate glass is developed for multimaterial additive manufacturing of multifunctional microfluidics. Glass, metal conductors, and sacrificial polymer are coprinted, enabling monolithic fabrication. The sacrificial paste forms precise channels and decomposes during sintering.
Babak Mazinani   +2 more
wiley   +1 more source

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