Results 121 to 130 of about 7,903 (261)

Reconfigurable Spoof Plasmonic Skyrmion Electronics for Deformation‐Invariant Multimode Sensing

open access: yesAdvanced Science, EarlyView.
A flexible multimode sensor based on capacitively loaded spoof plasmonic skyrmions enables deformation‐invariant dielectric sensing with ultra‐compact size and high Q‐factor. Near‐equidistant resonances remain stable under shape change and bending, while capacitor loading improves bending robustness and multimode sensitivity, highlighting strong ...
Zengxiang Wang   +7 more
wiley   +1 more source

Bioinspired Morphology‐Decoupled Soft Gripper with Enhanced Bidirectional Grasping Capability

open access: yesAdvanced Science, EarlyView.
Inspired by biological predation, a novel gripper decouples cross‐modal grasping via dual morphological configurations. Synergistically integrating hybrid rigid and soft coupled fingers with a metamaterial palm, the system performs active compliant grasping for static objects and passive cage capture for dynamic targets.
Yedong Huang   +4 more
wiley   +1 more source

A chip-scale atomic beam for nonclassical light. [PDF]

open access: yesSci Adv
Larsen BJ   +6 more
europepmc   +1 more source

Dual‐Mode Type I/II Photosensitization of a Stable Mesoporous Hydrogen‐Bonded Organic Framework for Antibacterial Therapy

open access: yesAdvanced Science, EarlyView.
A π‐conjugated donor–acceptor PDI monomer undergoes hydrogen‐bonded self‐assembly to form a robust mesoporous framework. The ordered molecular arrangement promotes efficient intersystem crossing and charge separation, leading to simultaneous Type I and Type II reactive oxygen species generation with a high singlet oxygen quantum yield.
Yi‐Lun Cheng   +10 more
wiley   +1 more source

Crystal Structure and Magnetic Modulation of Rubidium-Intercalated 2‑Phenylnaphthalene. [PDF]

open access: yesACS Omega
Wu X   +8 more
europepmc   +1 more source

Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation

open access: yesAdvanced Science, EarlyView.
Vertically aligned graphene microstrip pads (GMPs) break the traditional thermomechanical trade‐off in thermal interface materials. It simultaneously achieves an ultrahigh through‐plane thermal conductivity of 565.92 W m−1 K−1 and an ultralow compressive modulus below 115.16 kPa.
Xu Ran   +7 more
wiley   +1 more source

1D-3D Coordination Polymers Based on M<sub>4</sub>Cu<sub>4</sub>‑Phenylsilsesquioxane (M = K, Rb, Cs) Cages: Synthesis, Structure, and Catalytic Activity. [PDF]

open access: yesACS Omega
Astakhov GS   +13 more
europepmc   +1 more source

Stress‐to‐Light Conversion in an Earth‐Abundant Oxide Semiconductor

open access: yesAdvanced Science, EarlyView.
Stress‐to‐light conversion in solids represents a unique photonic functionality, yet it has never been realized in a chemically simple and sustainable material. Here, we show that sustainable semiconductor ZnO exhibits strong near‐infrared (NIR) luminescence under elastic stress when defect‐engineered to stabilize the p‐type state.
Tomoki Uchiyama   +7 more
wiley   +1 more source

Rubidium [PDF]

open access: yes, 2017
D. Meißner, T. Arndt
openaire   +1 more source

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