Results 111 to 120 of about 5,897,692 (241)

Simulation‐Based Analysis of Insert Pull‐Out in Nickel‐Polyurethane Hybrid Foams Using CT‐Derived Geometries

Advanced Engineering Materials, EarlyView.
CT‐based finite element simulations combined with in situ X‐ray computed tomography are used to analyze insert pull‐out in nickel‐coated polymer foams. Despite variations in material parameters, deformation consistently concentrates within a narrow annular region around the insert.
Yannik Bautz, Jonas Fell, Hendrik Jost, Stefan Diebels, Hans‐Georg Herrmann   +4 more
wiley   +1 more source

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

Advanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan, Jiafen Song, Jinglong Li, Jiangtao Xiong, Tao Yang   +4 more
wiley   +1 more source

Low-Secondary Electron Yield of Ferrromagnetic Materials and Magnetized Surfaces

, 2010
Low-secondary emission materials are required to avoid multipactor effect in large particle accelerators and communications. We are presenting direct measurements of the secondary electron emission yield (SEY) for several magnetic materials like ...
Montero, I, Montesinos, E, Galán, L, Raboso, D, Aguilera, L, Caspers, F   +5 more
core  

Role of surface microgeometries on electron escape probability and secondary electron yield of metal surfaces. [PDF]

Sci Rep, 2020
Bajek D, Wackerow S, Zanin DA, Baudin L, Bogdanowicz K, Valdivieso EG, Calatroni S, Di Girolamo B, Sitko M, Himmerlich M, Taborelli M, Chiggiato P, Abdolvand A.   +12 more
europepmc   +1 more source

Effect of Cu and CuP Additions on the Microstructure and Nanoindentation‐Based Fracture Behavior of CoNiAlSi Ferromagnetic Shape Memory Alloys

Advanced Engineering Materials, EarlyView.
Cu and combined Cu–P microalloying refine the microstructure and enhance the nanoindentation‐derived fracture resistance of CoNiAlSi ferromagnetic shape memory alloys without suppressing the martensitic transformation. Comparative SEM, DSC, and nanoindentation results reveal that the CuP‐containing alloy provides the most balanced response, achieving ...
Mehmet Demir
wiley   +1 more source

Aluminum Secondary Electron Yield

, 2019
Accurate modeling of spacecraft charging is essential to mitigate well-known and all-too-common deleterious and costly effects on spacecraft resulting from charging induced by interactions with the space plasma environment.
Dennison, JR, Lundgreen, Phillip
core   +1 more source

The Effect of Ultrasonic Cleaning on the Secondary Electron Yield, Surface Topography, and Surface Chemistry of Laser Treated Aluminum Alloy. [PDF]

Materials (Basel), 2020
Wang J, Gao Y, You Z, Fan J, Zhang J, Wang S, Xu Z.   +6 more
europepmc   +1 more source

Cryogenic Deformation Behavior of TiAl and Insights Into Embrittlement After High‐Temperature Exposure Combined With Secondary Ion Mass Spectroscopy of Near Surface Chemistry

Advanced Engineering Materials, EarlyView.
Near‐surface deuterium enrichment profiles for different microstructural types of TiAl after exposure at 700 °C in a heavy water‐containing environment. The deuterium levels are significantly higher than expected from natural occurrence, indicating that the heavy water dissociated during the exposure treatment and entered the specimens.
Jonathan D. H. Paul, Alexander Welle, Dirk Matthiessen, Michael Oehring, Fritz Appel, Florian Pyczak   +5 more
wiley   +1 more source

The measurements of total electron yield from silver

, 2009
A device for measuring total electron yields in the energy range 4–65 keV from conductor was set up successfully, which was made up of electron gun system, vacuum system and electrical system.
A.-G. Xie, L. Wang, Y.-J. Pei, C.-Q. Li
core   +1 more source

Optoelectronic Synaptic Devices Using Molecular Telluride Phase‐Change Inks for Three‐Factor Learning

Advanced Functional Materials, EarlyView.
Optoelectronic synaptic devices based on solution‐processed molecular telluride GST‐225 phase‐change inks are demonstrated for three‐factor learning. A global optical signal broadcast through a silicon waveguide induces non‐volatile conductance updates exclusively in locally electrically flagged memristors.
Kevin Portner, Dhananjeya Kumaar, Giacomo Torti, Killian Keller, Till Zellweger, Florian M. Schenk, Christoph Weilenmann, Daniel Chelladurai, Vara Prasad Jonnalagadda, Ghazi Sarwat Syed, Vanessa Wood, Jürg Leuthold, Alexandros Emboras, Maksym Yarema, Mathieu Luisier   +14 more
wiley   +1 more source