Results 211 to 220 of about 27,379 (267)

Smart molecular design for functional cellulose gels and flexible devices

Smart Molecules, Volume 4, Issue 1, March 2026.
This review systematically outlines the performance enhancement of cellulose gels, presenting optimization strategies across molecular, supramolecular, and macroscopic scales. It discusses advanced approaches to improve their mechanical, electrical, and thermal properties, and highlights promising applications in flexible robotics, electric devices, e ...
Zeshi Li, Minxin Wang, Geyuan Jiang, Jianhong Zhou, Donghan Li, Weihua Zhang, Dawei Zhao   +6 more
wiley   +1 more source

Enhanced thermoelectric performance in Fe₂V_0.8W_0.2Al thin films: synergistic effects of chemical ordering and tungsten substitution.

J Mater Chem A Mater
Domínguez-Vázquez JM, Tenaguillo MÁ, Lohani K, Caballero-Calero O, Manzano CV, Plata JJ, Marquez AM, Cebollada A, Conca A, Martín-González M.   +9 more
europepmc   +1 more source

Reduced Lattice Thermal Conductivity in Thermoelectric α-MgAgSb via Sb₂Te₃ Powder Atomic Layer Deposition. [PDF]

ACS Appl Mater Interfaces
García Santamaría I, Bahrami A, Wrzesińska-Lashkova A, Charvot J, Sotnikov A, Giebeler L, Vaynzof Y, Bureš F, Ying P, Nielsch K.   +9 more
europepmc   +1 more source

Thermally Stable, Low‐Resistance Cu Alloy Contacts for Mg3(Sb, Bi)2 Thermoelectric Materials by Two‐Step Contacting

Small Structures, Volume 7, Issue 3, March 2026.
Selection of suitable electrical contact is crucial for achieving low specific contact resistivity (ρc) at the electrode/thermoelectric (TE) material interface. Sustaining low ρc is far more critical than merely attaining a low value. Moreover, the conversion efficiency (η) and durability are often limited by unstable contact interfaces at various ...
Muhammad Fasih Aamir, Jayachandran Babu, Raju Chetty, Takao Mori   +3 more
wiley   +1 more source

Unveiling InTe for flexible thermoelectric applications with enhanced performance via Bi/Se co-doping and MnO₂ integration. [PDF]

Sci Rep
Shankar MR, Prabhu AN, Nayak R.
europepmc   +1 more source

Atomic Layer Deposited Cu Incorporation Enables Enhanced Thermoelectric Performance in n‐Type Mg3(Sb, Bi)2

Small Structures, Volume 7, Issue 3, March 2026.
A metallic Cu powder atomic layer deposition (pALD) strategy is developed to engineer particle‐boundary interfaces in n‐type Mg3(Sb, Bi)2. Cu‐induced grain growth and compensation of Mg deficiencies at particle boundaries, enhance carrier mobility, while Cu‐rich boundary domains introduce additional phonon scattering.
Jun Li, Shiyang He, Falk Röder, Jonas Winkler, Panpan Zhao, Kyuseon Jang, Siyuan Zhang, Abhishek Pandey, Angelika Wrzesińska‐Lashkova, Yana Vaynzof, Christina Scheu, Kornelius Nielsch, Amin Bahrami   +12 more
wiley   +1 more source

Absence of Transport Altermagnetic Spin-Splitting Effect in RuO₂. [PDF]

Nano Lett
Wang YC, Shen ZY, Lin CH, Hsu WC, Chen YS, Chin YY, Singh AK, Lee WL, Chen CT, Huang SY, Qu D.   +10 more
europepmc   +1 more source

Nanoscale geometrical patterning for junctionless thermoelectrics

Gonzalez-Munoz S, Xiao P, Evangeli C, Castanon E, Finch S, Hamer M, Zultak J, Kazakova O, Siret K, McCann E, Gorbachev R, Kolosov O, Sachat AE.   +12 more
europepmc   +1 more source

Investigation of enhanced thermoelectric response in the extended Lieb lattice using the Hubbard model. [PDF]

Sci Rep
Norian E, Astinchap B, Abdi M.
europepmc   +1 more source