Results 201 to 210 of about 2,717,459 (291)
Rotary 3D Printing With Integrated Electroplating
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria +5 more
wiley +1 more source
PBRM1 Deficiency in Microglia Leads to Excessive Neurogenesis and Autism-Like Behaviors via the CCL5-CCR1/5-β-catenin Signaling Axis. [PDF]
Duan YY +12 more
europepmc +1 more source
A high interstital austenitic steel is additively manufactured and postdensified by HIP to eliminate gas porosity. Thereby, the loss of N and Mn in Ar HIP atmosphere is investigated. Further, HIP using N2 atmosphere is investigated which led to excessive nitride formation.
F. Großwendt +4 more
wiley +1 more source
Oxidation-regulated wide-temperature tribological behavior and mechanism of a Mo/Mo tribopair lubricated by Ga-based liquid metal. [PDF]
Wang Q +10 more
europepmc +1 more source
PUF/ENB microcapsules were synthesized based on a sequential factorial design and incorporated into an epoxy matrix. Their anticorrosive action, associated with the self‐healing mechanism, demonstrated that the addition of microcapsules to the coating improved anticorrosive performance compared to pure epoxy coatings, particularly when the encapsulate ...
Vandicleya Alves Moreira +6 more
wiley +1 more source
New Method to Form Colloidal Gold: Spontaneous Transformation from Nanoporous Anodic Gold Oxide Film into Gold Nanoparticles in Pure Water. [PDF]
Fujita T +5 more
europepmc +1 more source
Electrodeposition in Structural Lattices of Variable Architectures
Electrodeposition enables geometry‐sensitive, autonomous void filling while simultaneously tuning chemical and mechanical properties. The development of approaches that can autonomously fill and heal material voids and yield composites with tailorable properties is increasingly relevant in engineering.
Yeong‐Man Kwon +3 more
wiley +1 more source

