Results 221 to 230 of about 2,904,856 (394)

Optimization of the Rheological Properties of Fumed‐Silica‐Based Supporting Baths for Embedded Printing and Reduction of the Effect of Crevasse Formation

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Optimization of the rheological properties of supporting baths based on fumed silica with different alkyl chains functionalization suspended in polyethylene glycol and adjustment of the rheology of the ink to reduce the effect of the crevasses formed in high‐yield stress supporting baths to approach embedded 3D prints with high shape accuracy ...
Grace Vera   +5 more
wiley   +1 more source

Advanced Techniques for Scalable Woven E‐Textiles Manufacturing

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin   +2 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Shear Wall Test Data Summary

open access: green, 1991
Charles R. Farrar, R.M. Kenneally
openalex   +1 more source

Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley   +1 more source

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