Experimental and Numerical Studies of Sheet Metal Forming with Damage Using Gas Detonation Process [PDF]
, 2017 Sandeep P. Patil +4 more
openalex +1 more source
Dual‐Ligand Metal‐Organic Frameworks via In Situ Amidoxime Engineering for Selective Ion Separation
Advanced Functional Materials, EarlyView.Inspired by microbial ion‐trapping mechanisms, a mild and universal strategy is developed to construct highly porous amidoxime‐functionalized MOFs. DFT calculations and molecular force measurements reveal that the dual‐ligand amidoxime configuration significantly strengthens Ga(III) affinity.
Zhifang Lv +9 more
wiley +1 more source
A Deformational Analysis of a Titanium Alloy Supported by the Mathematical Modelling of the Sheet Metal Forming Process via Numerical Simulation. [PDF]
Materials (Basel)Koreček D, Solfronk P, Sobotka J.
europepmc +1 more source
Influence of Changing Loading Directions on Damage in Sheet Metal Forming
, 2023 Philipp Lennemann +3 more
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Fluorine‐Free Soft Nanocomposites for High‐Speed Liquid Impact Repellence
Advanced Functional Materials, EarlyView.Fluorine‐free soft nanocomposite coatings are developed using silicone oil‐mediated mechanical‐stiffness control, enabling ‘dry’ liquid‐repellent surfaces that resist high‐speed water jet impacts up to ∼60 m/s. By tuning nanoparticle loading and oil content, the coatings also achieve >90% optical transparency, amphiphobicity with impact resistance to ...
Priya Mandal +4 more
wiley +1 more source
Publisher Correction: A non-associated constitutive model based on yld2004-18p yield criterion and its applications on sheet metal forming analysis. [PDF]
Sci RepWang H +6 more
europepmc +1 more source
Investigation of Sheet Metal Forming Using a Rapid Compression Machine. [PDF]
Materials (Basel), 2019 Patil SP +4 more
europepmc +1 more source
A GEOMETRIC MAPPING APPROACH TO STRAIN PREDICTION IN SHEET METAL FORMING
, 2002 Lawrence Tsai, Michael Cardew-Hall
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Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
Advanced Functional Materials, EarlyView.This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source