Results 161 to 170 of about 1,264 (239)
Memory-assisted multimode microwave-to-optical transduction. [PDF]
Gautam U +3 more
europepmc +1 more source
Breaking Bottlenecks in Solid Electrolyte Discovery With Large Artificial Intelligence Models
Large AI models are presented as a route to break key bottlenecks in solid electrolyte discovery by linking materials databases, machine‐learning interatomic potentials, large language models, and autonomous experiments. This perspective highlights how AI can accelerate the identification of solid electrolytes with fast ion transport, stable interfaces,
Eric Jianfeng Cheng +24 more
wiley +1 more source
Heterogeneous Integration Technology Drives the Evolution of Co-Packaged Optics. [PDF]
Gao H, Yan W, Zhang D, Yu D.
europepmc +1 more source
Oxidized Nd‐Fe‐B magnet swarf is transformed into valuable bulk feedstock through a single‐step hydrogen plasma process. The reaction converts complex rare‐earth‐containing waste into separated metallic, oxide, and hydride fractions without acid leaching.
Naritai Chimed +9 more
wiley +1 more source
Foundry-enabled wafer-scale characterization and modeling of silicon photonic DWDM links. [PDF]
Parsons R +8 more
europepmc +1 more source
Recent Advances in Plasma‐Enhanced Atomic Layer Etching for Next‐Generation Nanofabrication
Continued semiconductor miniaturization demands atomic‐scale patterning and ultralow surface roughness beyond the capabilities of conventional reactive ion etching. This review highlights advances in isotropic and anisotropic plasma‐enhanced atomic layer etching since 2020, covering fundamental mechanisms, applications across major semiconductor ...
Shih‐Nan Hsiao
wiley +1 more source
Wearable ultrasound: a review of core technologies and clinical applications in cardiovascular monitoring. [PDF]
Yan M +10 more
europepmc +1 more source
The PTL–CL interface plays a decisive role in PEMWE performance by governing electron conduction, water supply, oxygen removal, catalyst utilization, and interfacial stability. This review summarizes interface‐related resistance sources, characterization methods, and engineering strategies, highlighting rational PTL–CL interface design for low‐cost ...
Aobo Wan, Zhengkai Tu
wiley +1 more source
Harnessing diverse hybrid integration for bridging trans-scale multi-dimensional fiber-chip data transmission and processing. [PDF]
Li K +10 more
europepmc +1 more source

