Results 151 to 160 of about 25,719 (290)
Shrinkage estimators for a composite measure of quality conceptualized as a formative construct. [PDF]
Shwartz M +4 more
europepmc +1 more source
Dicarboxylate‐modified anionic hairy cellulose nanocrystals exhibit a high selectivity for dysprosium(III) over neodymium(III). This selectivity arises from disordered dicarboxylate cellulose “hairs” that enable cooperative ionic coordination, hydrogen bonding, and strain‐induced conformational shrinkage.
Roya Koshani +6 more
wiley +1 more source
Dense Nanofibrillar Collagen–Silica Hybrids with High Strength and ECM‐Mimetic Tissue Integration
Dense nanofibrillar collagen–silica hybrids are engineered by synchronizing collagen fibrillogenesis with silica condensation, producing printable scaffolds that unexpectedly approach native extracellular matrix organization and strength. These cell‐free constructs guide endogenous cell‐infiltration, enable localized matrix remodeling, and integrate ...
Norein Norein +7 more
wiley +1 more source
3D‐Printed Porous Hydroxyapatite Formed via Enzymatic Mineralization
Bone combines lightness, strength, and the ability to heal, inspiring new materials design. This work introduces a room‐temperature, enzyme‐mediated 3D printing method to create porous hydroxyapatite scaffolds. The process avoids energy‐intensive sintering, preserves bioactivity, and allows control over porosity and mineralization.
Francesca Bono +6 more
wiley +1 more source
Fluorine‐Free Soft Nanocomposites for High‐Speed Liquid Impact Repellence
Fluorine‐free soft nanocomposite coatings are developed using silicone oil‐mediated mechanical‐stiffness control, enabling ‘dry’ liquid‐repellent surfaces that resist high‐speed water jet impacts up to ∼60 m/s. By tuning nanoparticle loading and oil content, the coatings also achieve >90% optical transparency, amphiphobicity with impact resistance to ...
Priya Mandal +4 more
wiley +1 more source
Conductive Bonding and System Architectures for High‐Performance Flexible Electronics
This review outlines bonding technologies and structural design strategies that support high‐performance flexible and stretchable electronics. Bonding approaches such as surface‐activated bonding and anisotropic conductive films, together with system‐level architectures including buffer layers and island‐bridge structures, possess distinct mechanical ...
Kazuma Nakajima, Kenjiro Fukuda
wiley +1 more source
Applying a high electric field to a doped organic semiconductor heats up the charge carrier distribution beyond the lattice temperature, enhancing conductivity. It is shown that the associated effective temperature can be used to extract the effective localization length, which is a characteristic length scale of charge transport and provides ...
Morteza Shokrani +4 more
wiley +1 more source
Reducing power consumption in spintronic memory remains a major challenge due to the need for high current densities. A bilayer of gadolinium and holmium iron garnets enables purely temperature‐induced, nonvolatile magnetic switching with bistable states within a ±25 K range. This approach achieves up to 66‐fold lower energy use than current spin–orbit
Junseok Kim +3 more
wiley +1 more source
Unsupervised Liu-type shrinkage estimators for mixture of regression models. [PDF]
Ghanem E, Hatefi A, Usefi H.
europepmc +1 more source
Comparison of targeted maximum likelihood and shrinkage estimators of parameters in gene networks. [PDF]
Geeven G, van der Laan MJ, de Gunst MC.
europepmc +1 more source

