Results 11 to 20 of about 44,408 (304)

Design and Analysis of a Novel Compact Metamaterial Absorber Based on Double-Layer ITO Resistive Film for Improving Signal Integrity

IEEE Access, 2022
This paper presents a compact metamaterial absorber (MMA) based on double-layer ITO resistive film for suppression of electromagnetic interference (EMI) to improve signal quality and signal integrity (SI).
Xiaoyong Lei, Yan Li, Shuyun Huo, Zhe Sun, Heyuan Yu, Lidan Fang, Shaojie Xu, Bingheng Li, Mengjun Wang, Erping Li   +9 more
doaj   +1 more source

AI Models for Supporting SI Analysis on PCB Net Structures: Comparing Linear and Non-Linear Data Sources [PDF]

Advances in Radio Science, 2023
Signal integrity (SI) is an essential part in assuring the functionality of microelectronic components on a printed circuit board (PCB). Depending on the complexity of the designed interconnect structure, even the experienced PCB developer might be ...
J. Withöft, W. John, E. Ecik, R. Brüning, J. Götze   +4 more
doaj   +1 more source

An Ultrawideband Bidirectional Absorptive Common-Mode Filter With All-Pass Signal Transmission

IEEE Access, 2022
This study proposes a miniaturized strip-line absorptive common-mode filter using a novel and ingenious defected ground structure (DGS). The proposed filter is bidirectional and has an ultrawide absorption band to stop the common-mode noise.
Yu-Hsiang Chen, Cheng-Nan Chiu
doaj   +1 more source

A Machine Learning-Based Epistemic Modeling Framework for EMC and SI Assessment [PDF]

, 2020
A novel machine learning-based framework is presented to evaluate the effect of design parameters, affected by epistemic uncertainty, on the Signal Integrity (SI) and Electromagnetic Compatibility (EMC) performance of electronic products.
Dhaene T., Kan D., Spina D., Rogier H., Grassi F., Ginste D. V., De Ridder S.   +6 more
core   +1 more source

BP-NGD Signal Integrity Application for RLC-Cable Parasitic Dispersion Reduction [PDF]

, 2023
International audienceA cable RLC-parasitic dispersion reduction by using bandpass (BP) negative group delay (NGD) circuit for signal integrity (SI) and EMC application is stressed.
Gu, T., Ravelo, B., Wan, F., Thakur, A., Thakur, P., Rahajandraibe, W., Haddad, F., Guerin, Mathieu   +7 more
core   +1 more source

Electrical Performance Analysis of High-Speed Interconnection and Power Delivery Network (PDN) in Low-Loss Glass Substrate-Based Interposers

Micromachines, 2023
In this article, electrical performance analysis of high-speed interconnection and power delivery network (PDN) in low-loss glass substrate-based interposers is conducted considering signal integrity (SI) and power integrity (PI).
Youngwoo Kim
doaj   +1 more source

Signal Integrity Analysis of High Speed Channel considering Thermal Distribution [PDF]

, 2021
In this paper, we analyzed a high speed PCB channel and silicon interposer channel considering thermal distribution. High temperature degrades the signal integrity (SI) performances of channel.
Daehwan Lho, Hyunwook Park, Kim, SeongGuk, Lho, Daehwan, Son, Keeyoung, Kim, Joungho, Keunwoo Kim, Gapyeol Park, Kim, Keunwoo, Park, Hyunwook, Keeyoung Son, Seongguk Kim, Joungho Kim, Park, Gap Yeol, Minsu Kim   +14 more
core   +1 more source

DC-compliant small-signal macromodels of non-linear circuit blocks [PDF]

, 2013
This paper presents a novel strategy to improve the accuracy of macromodel-based approaches for fast Signal Integrity assessment for highly integrated Radio Frequency (RF) and Analog-Mixed-Signal (AMS) Systems on Chip (SoC).
OLIVADESE, SALVATORE BERNARDO, S. B. Olivadese, Brenner P., GRIVET TALOCIA, STEFANO, P. Brenner, S. Grivet-Talocia   +5 more
core   +1 more source

A Compact Meander-Bridge Electromagnetic Band-Gap Structure for Suppressing Simultaneous Switching Noise [PDF]

Journal of Microwaves, Optoelectronics and Electromagnetic Applications
In this article, a new Meander-Bridge Electromagnetic Band-Gap Structure was proposed for the suppression of Simultaneously Switching Noises (SSN) over a wide frequency range, with dimensions of 15 x 15 mm and a useful area of 100 mm2.
J. C. B. Dalcin, M. Bonfim
doaj   +1 more source

Validation by Measurements of a IC Modeling Approach for SiP Applications [PDF]

, 2011
The growing importance of signal integrity (SI) analysis in integrated circuits (ICs), revealed by modern systemin-package methods, is demanding for new models for the IC sub-systems which are both accurate, efficient and extractable by simple ...
Teixeira, H.M., Vitale, F., Telmo R. Cunha, Stievano, Igor Simone, Roberto Izzi, Izzi, R., Igor S. Stievano, Antonio Girardi, Cunha, T. R., Pedro, J.C., Hugo M. Teixeira, Luca Rigazio, Teixeira, H. M., Filippo Vitale, Cunha, T.R., Girardi, A., Pedro, J. C., Flavio G. Canavero, José C. Pedro, Rigazio, Luca, Canavero, Flavio   +20 more
core   +1 more source