Results 21 to 30 of about 1,778,075 (341)

Fully Integrated High-Performance MEMS Energy Harvester for Mechanical and Contactless Magnetic Excitation in Resonance and at Low Frequencies

Micromachines, 2022
Energy harvesting and storage is highly demanded to enhance the lifetime of autonomous systems, such as IoT sensor nodes, avoiding costly and time-consuming battery replacement.
Mani Teja Bodduluri, Torben Dankwort, Thomas Lisec, Sven Grünzig, Anmol Khare, Minhaz Ahmed, Björn Gojdka   +6 more
doaj   +1 more source

Increasing Light Load Efficiency in Phase-Shifted, Variable Frequency Multiport Series Resonant Converters

IEEE Access, 2023
Multiport power conversion topologies provide the capability of multiple independent converters with a single transformer having multiple windings (i.e., ports) potentially increasing power densities and enabling flexible (and bidirectional) power ...
Thomas Langbauer, Alexander Connaughton, Franz Vollmaier, Zhen Huang, Klaus Krischan, Roberto Petrella   +5 more
doaj   +1 more source

Sustainable Multifunctional Biface Sensor Tag

Advanced Sensor Research, 2023
In this article, a sustainable, multifunctional, low‐cost, wireless sensor tag is presented. The sensor tag combines three different environmental sensors in one single platform for the dedicated purpose of wireless structural health monitoring of a ...
Lukas Rauter, Johanna Zikulnig, Thomas Moldaschl, Martin Lenzhofer, Sherjeel Khan, Lukas Neumaier, Sabine Lengger, Tutku Beduk, Muhammad‐Hassan Malik, Manoj Jose, Hubert Zangl, Juergen Kosel   +11 more
doaj   +1 more source

Additive Manufacturing for Nano-Feature Applications: Electrohydrodynamic Printing as a Next-Generation Enabling Technology

IEEE Open Journal of Nanotechnology, 2022
Regardless of the technology, additive or subtractive, the miniaturization trend is constantly pushing for smaller resolutions. The rise of global challenges in material availability, fabrication in three dimensions (3D), design flexibility and rapid ...
Goran Miskovic, Robin Kaufhold
doaj   +1 more source

Towards Robust Thermal MEMS: Demonstration of a Novel Approach for Solid Thermal Isolation by Substrate-Level Integrated Porous Microstructures

Micromachines, 2022
Most current thermal MEMS use fragile structures such as thin-film membranes or microcantilevers for thermal isolation. To increase the robustness of these devices, solid thermal insulators that are compatible with MEMS cleanroom processing are needed ...
Ole Behrmann, Thomas Lisec, Björn Gojdka   +2 more
doaj   +1 more source

Correlation of Scale Factor Non-Linearity and Vibration Rectification Error in Vibrating Beam Accelerometers

IEEE Access
Vibration Rectification Error (VRE) is a critical parameter for high-performance accelerometers operating in dynamic environments. This paper presents a focused experimental study to rigorously investigate the relationship between VRE and Scale Factor ...
Theo Miani, Lokesh Gurung, Douglas Young, Madan Parajuli, Guillermo Sobreviela-Falces, Colin Baker, Ashwin A. Seshia   +6 more
doaj   +1 more source

Evaluation of the Sheet Resistance of Inkjet-Printed Ag-Layers on Flexible, Uncoated Paper Substrates Using Van-der-Pauw’s Method

Sensors, 2020
With the growing significance of printed sensors on the electronics market, new demands on quality and reproducibility have arisen. While most printing processes on standard substrates (e.g., Polyethylene terephthalate (PET)) are well-defined, the ...
Johanna Zikulnig, Ali Roshanghias, Lukas Rauter, Christina Hirschl   +3 more
doaj   +1 more source

Raman Spectroscopy and Spectral Signatures of AlScN/Al₂O₃

Micromachines, 2022
III-V solid solutions are sensitive to growth conditions due to their stochastic nature. The highly crystalline thin films require a profound understanding of the material properties and reliable means of their determination.
Dmytro Solonenko, Agnė Žukauskaitė, Julian Pilz, Mohssen Moridi, Sarah Risquez   +4 more
doaj   +1 more source

High Temperature Magnetic Cores Based on PowderMEMS Technique for Integrated Inductors with Active Cooling

Micromachines, 2022
The paper presents the realization and characterization of micro-inductors with core with active cooling capability for future integrated DC/DC converter solutions operating with wide bandgap semiconductors at high temperatures with high power densities.
Malte Paesler, Thomas Lisec, Holger Kapels   +2 more
doaj   +1 more source

Fluorescent Silicon Clusters and Nanoparticles

, 2017
The fluorescence of silicon clusters is reviewed. Atomic clusters of silicon have been at the focus of research for several decades because of the relevance of size effects for material properties, the importance of silicon in electronics and the ...
Dasog, Dohnalová K., Erogbogbo F., Feng, Fox M., Hayes W., He Y., Hoffmann M. A., Hofmeister H., Lyon J. T., Pavesi L., von Haeften K., Yazdanfar H.   +12 more
core   +1 more source