Results 151 to 160 of about 108,046 (317)
Hybrid Silicon Nitride Photonic Integrated Circuits Covered by Single-Walled Carbon Nanotube Films [PDF]
Sophia Komrakova +9 more
openalex +1 more source
3D integration enables ultralow-noise isolator-free lasers in silicon photonics. [PDF]
Xiang C +14 more
europepmc +1 more source
AI‐Assisted Workflow for (Scanning) Transmission Electron Microscopy: From Data Analysis Automation to Materials Knowledge Unveiling. Abstract (Scanning) transmission electron microscopy ((S)TEM) has significantly advanced materials science but faces challenges in correlating precise atomic structure information with the functional properties of ...
Marc Botifoll +19 more
wiley +1 more source
Hybrid silicon photonic devices with two-dimensional materials [PDF]
Jiang Li +5 more
openalex +1 more source
Near-IR & Mid-IR Silicon Photonics Modulators. [PDF]
Georgiev GV +7 more
europepmc +1 more source
Opportunities of Semiconducting Oxide Nanostructures as Advanced Luminescent Materials in Photonics
The review discusses the challenges of wide and ultrawide bandgap semiconducting oxides as a suitable material platform for photonics. They offer great versatility in terms of tuning microstructure, native defects, doping, anisotropy, and micro‐ and nano‐structuring. The review focuses on their light emission, light‐confinement in optical cavities, and
Ana Cremades +7 more
wiley +1 more source
In-chip critical plasma seeds for laser writing of reconfigurable silicon photonics systems. [PDF]
Wang A +5 more
europepmc +2 more sources
Hybrid InGaP nanobeam on silicon photonics for efficient four wave mixing [PDF]
Gabriel Marty +3 more
openalex +1 more source
Design Improvements of a Silicon Photonic ROADM (Project Report CIAN2-1-Y4)
Shayan Mookherjee
openalex +2 more sources
This study demonstrates a self‐assembly process to generate free‐standing piezoelectric nanomembranes, forming ultracompact microtubular acoustic wave sensors and actuators. The miniaturized 3D piezoelectric platform reported in this work can be applied in telecommunication, energy harvesting, and acoustofluidics. Moreover, the 3D self‐assembly can add
Raphaël C. L‐M. Doineau +9 more
wiley +1 more source

