Results 261 to 270 of about 494,648 (339)
Theoretical investigation and practical validation of AI based fault detection in BJT amplifier circuits. [PDF]
Selim KK +3 more
europepmc +1 more source
Sucrose‐derived porous carbon network (SPINE‐C) is formed within CNT fibers via FCCVD, bridging inter‐bundles of CNTs and increasing surface area through introduced microporosity. As a result, both mechanical and electrochemical properties are simultaneously enhanced, leading to a 2.8‐fold increase in the power density of a mechano‐electrochemical ...
Hocheol Gwac +9 more
wiley +1 more source
Design of improved internal mode controller for hydro-turbine governing system based on generalized inverse solver method. [PDF]
Zhang J +5 more
europepmc +1 more source
A multiscale‐architected phase change material (PCM) composite combines latent heat storage, PCM leakage proof, directional thermal conduction, electromagnetic interference (EMI) shielding, and mechanical reinforcement via asymmetric MXene/cellulose aerogel and 3D‐printed metastructures, enabling effective thermal regulation, strong EMI shielding, and ...
Jiheon Kim +9 more
wiley +1 more source
Strong coupling of a superconducting flux qubit to single bismuth donors. [PDF]
Chang T +6 more
europepmc +1 more source
Highly Selective Toward HER or CO2RR by Regulating Cu Single and Dual Atoms on g‐C3N4
This systematic study provides insights into the design of electrocatalysts for hydrogen evolution reaction (HER) and carbon dioxide reduction (CO2RR). It serves as a useful guide for tuning catalyst architecture toward efficient multifunctional performance by varying synthetic parameters, demonstrating the impact of copper (Cu) species ranging from ...
Wan‐Ting Chen +9 more
wiley +1 more source
Development of Compact Electronics for QEPAS Sensors. [PDF]
Zecchino V +5 more
europepmc +1 more source
Device Integration Technology for Practical Flexible Electronics Systems
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa +5 more
wiley +1 more source

