Results 171 to 180 of about 2,130,840 (372)

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

Additive Manufacturing of Gradient Stiffness Honeycombs Using Thermoplastic Polyurethane Composite Material Variations

open access: yesAdvanced Engineering Materials, EarlyView.
By combining porous, solid, and carbon fiber‐reinforced thermoplastic polyurethane within a single 3D printed honeycomb structure, this current work achieved precise control over spatial stiffness while ensuring strong interlayer adhesion. The findings demonstrate enhanced energy absorption and densification strain, outperforming traditional uniform ...
Savvas Koltsakidis   +2 more
wiley   +1 more source

Bioinspired Materials, Designs, and Manufacturing Strategies for Advanced Impact‐Resistant Helmets

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores how bioinspired materials, structures, and manufacturing strategies transform helmet design to achieve enhanced impact resistance. Drawing inspiration from nacre, porcupine quills, beetle exoskeletons, and skull architectures, it highlights advances in auxetic lattices, nanocomposites, and functionally graded foams.
Joseph Schlager   +4 more
wiley   +1 more source

Osobliwe Równania Całkowe Termosprężystości

open access: yesEngineering Transactions, 1965
The present paper contains a derivation of the integral representation of the general solution of coupled linear elasticity. It is assumed that the material and thermal constants are independent of the temperature and that the vibration is harmonic.
J. Ignaczak, W. Nowacki
doaj  

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