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Investigation of Dielectric Materials in D2W Bonding: SiO2-SiO2, SiO2-SiCN, and SiCN-SiCN

2025 26th International Conference on Electronic Packaging Technology (ICEPT)
Anqi Zhou   +5 more
openaire   +1 more source

The Ternary System: K2SiO3—Na2SiO3—SiO2

The Journal of Physical Chemistry, 1932
openaire   +1 more source

The system MgO-FeO-SiO 2

American Journal of Science, 1935
N. L. Bowen, J. F. Schairer
openaire   +1 more source

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