Results 251 to 260 of about 1,271,862 (339)

Harnessing Non‐Covalent Protein–Protein Interaction Domains for Production of Biocatalytic Materials Systems

open access: yesAdvanced Functional Materials, EarlyView.
Non‐covalent protein–protein interactions mediated by SH3, PDZ, or GBD domains enable the self‐assembly of stable and biocatalytically active hydrogel materials. These soft materials can be processed into monodisperse foams that, once dried, exhibit enhanced mechanical stability and activity and are easily integrated into microstructured flow ...
Julian S. Hertel   +5 more
wiley   +1 more source

MOFs and COFs in Electronics: Bridging the Gap between Intrinsic Properties and Measured Performance

open access: yesAdvanced Functional Materials, EarlyView.
Metal‐organic frameworks (MOFs) and covalent organic frameworks (COFs) hold promise for advanced electronics. However, discrepancies in reported electrical conductivities highlight the importance of measurement methodologies. This review explores intrinsic charge transport mechanisms and extrinsic factors influencing performance, and critically ...
Jonas F. Pöhls, R. Thomas Weitz
wiley   +1 more source

Social mobility and mental health in Canada. [PDF]

open access: yesCan J Public Health
Vanzella-Yang A, Veenstra G.
europepmc   +1 more source

Multicolor Optoelectronic Synapse Enabled by Photon‐Modulated Remote Doping in Solution‐Processed Van Der Waals Heterostructures

open access: yesAdvanced Functional Materials, EarlyView.
Multicolor optoelectronic synapses are realized by vertically integrating solution‐processed MoS2 thin‐film and SWCNT. The electronically disconnected but interactive MoS2 enables photon‐modulated remote doping, producing a bi‐directional photoresponse.
Jihyun Kim   +8 more
wiley   +1 more source

Device Integration Technology for Practical Flexible Electronics Systems

open access: yesAdvanced Functional Materials, EarlyView.
Flexible device integration technologies are essential for realizing practical flexible electronic systems. In this review paper, wiring and bonding techniques critical for the industrial‐scale manufacturing of wearable devices are emphasized based on flexible electronics.
Masahito Takakuwa   +5 more
wiley   +1 more source

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