Results 271 to 280 of about 9,252,467 (378)

Engineering Porous Hollow Metal‐Poly(Heptazine Imide) Spheres: An Optimized Synthetic Strategy for Controlling Surface, Morphology, and Properties

open access: yesAdvanced Functional Materials, EarlyView.
Hollow poly(heptazine imide) spheres are prepared through a novel approach that integrates hard templating with ionothermal synthesis. This method enables precise control over surface area, pore volume, hydrophilicity, light absorption, band position, and metal composition. These tunable properties facilitate the customized design of semiconductors for
Lingli Ni   +10 more
wiley   +1 more source

Fuzzy Semi Open Soft Sets Related Properties In Fuzzy Soft Topological Spaces

open access: gold, 2014
A. Kandil   +3 more
openalex   +2 more sources

Embedded 3D‐Coaxial Bioprinting of Stenotic Brain Vessels with a Mechanically Enhanced Extracellular Matrix Bioink for Investigating Hemodynamic Force‐Induced Endothelial Responses

open access: yesAdvanced Functional Materials, EarlyView.
In this study, a physically enhanced vascular dECM bioink and used 3D‐coaxial bioprinting are developed to fabricate mature brain blood vessels for cerebral atherosclerosis research. This model demonstrates that vascular geometry‐induced hemodynamic changes trigger vascular inflammation, ensuring its potential for cerebrovascular research.
Wonbin Park   +7 more
wiley   +1 more source

Nanodiamond‐Infused Microgels for pH‐Tunable Rheology, Lubrication, and UV Protection

open access: yesAdvanced Functional Materials, EarlyView.
Microgels consisting of swollen polyacrylic acid polymer networks, impregnated with nanodiamonds provide protection from ultraviolet (UV) radiation harmful to human health. Nanodiamonds enable UV blockage and control of the rheology (flow) and lubrication (skin‐feel) of these microgel‐skincare‐mimics.
Pallav K. Jani   +10 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

open access: yesAdvanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone   +11 more
wiley   +1 more source

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