Results 221 to 230 of about 5,927,341 (295)

Intelligent Matching Algorithm with Density-Based Clustering for UAV Swarm Networking. [PDF]

Sensors (Basel)
Kong L, Guo D, Xu J, Wang F, Wu J, Xin X.   +5 more
europepmc   +1 more source

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

Advanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan, Jiafen Song, Jinglong Li, Jiangtao Xiong, Tao Yang   +4 more
wiley   +1 more source

OSI Stack Redesign for Quantum Networks: Requirements, Technologies, Challenges, and Future Directions. [PDF]

Sensors (Basel)
Ahmed S, Osman Y, Cue L, Almazyad I, Albalawi NS, Saeed MK, Khokhar A.   +6 more
europepmc   +1 more source

Effects of Mg on Microstructure and Solidification of a Hypereutectic Zn–8 wt.%Al Alloy

Advanced Engineering Materials, EarlyView.
An appreciable set of results involving thermal data, microstructure, chemical composition, and microstructural growth laws is reported for ZnAlMg alloys. Such results demonstrate that ZnAlMg alloys have high potential for applications in automotive self‐lubricating components, batteries, and electrical systems.
Raí B. de Sousa, Jeverton L. Paixão, Daylla S. Silva, Bruno S. Sobral, Mucio D. de Medeiros, José E. Spinelli, Bismarck L. Silva   +6 more
wiley   +1 more source

Photonic networking of quantum memories in high dimensions. [PDF]

Sci Adv
Shalaev M, Saha S, Toh G, Goetting I, Kalakuntla A, Shi HB, O'Reilly J, Yu Y, Monroe C.   +8 more
europepmc   +1 more source

Rotary 3D Printing With Integrated Electroplating

Advanced Engineering Materials, EarlyView.
A rotary material extrusion platform integrates localized copper electroplating with printing and encapsulation to fabricate cylindrical polymer–metal structures containing fully embedded, low‐resistance conductive pathways that enable internal Joule heating and thermally activated shape‐memory responses.
Antonio Zagaria, Nicola Larovere, Moslem Mohammadi, Gianluca Percoco, Ali Zolfagharian, Gianni Stano   +5 more
wiley   +1 more source

Electrodeposition in Structural Lattices of Variable Architectures

Advanced Engineering Materials, EarlyView.
Electrodeposition enables geometry‐sensitive, autonomous void filling while simultaneously tuning chemical and mechanical properties. The development of approaches that can autonomously fill and heal material voids and yield composites with tailorable properties is increasingly relevant in engineering.
Yeong‐Man Kwon, Jingwen Zhang, Guido Musso, Alessandro F. Rotta Loria   +3 more
wiley   +1 more source

Internship engagement as a predictive pathway between an academic self-concept proxy and employability outcomes: evidence from a public undergraduate employability dataset. [PDF]

Front Psychol
Zhong X, An K, Zhao X.
europepmc   +1 more source

Thermal Cycle–Microstructure–Property Relationships in Rail Steel Heat‐Affected Zone Simulated by Gleeble

Advanced Engineering Materials, EarlyView.
Microstructural evolution of premium rail steel during flash butt welding (FBW), comparing physically simulated heat‐affected zones with actual weld regions. Thermal cycles induce phase transformations and microstructural heterogeneity that influence weld quality and mechanical performance. These findings provide insights into optimizing FBW parameters
Emmanoelle Cintra da Cunha Araújo, João Marcos da Silva Nunes, Marcelly Cristiny Nunes de Carvalho, Alex Rojas, Cristie Luis Kugelmeier, Cristhian Ricardo Loayza Loayza, João Carlos Ferreira, Maria Veronica Goncalves Rodrigues, Rute Sayuri Kano, Isaac Araújo Furtado, Jacyara Dalylla da Silva Nunes, Jhonatan Peres de Sousa, Marcos Natan da Silva Lima, Eden Santos Silva, Gedeon Silva Reis, Samuel Filgueiras Rodrigues   +15 more
wiley   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source