Results 241 to 250 of about 281,995 (369)

An Operational Status Assessment Model for SF₆ High-Voltage Circuit Breakers Based on IAR-BTR. [PDF]

Sensors (Basel)
Wang N, Wang Y, Zhang Y, Tang C, Sun C.
europepmc   +1 more source

Enhancing Software Reliability through Intelligent Fault Prediction Using Machine Learning

Durga, Anupa Sinha
openalex   +1 more source

A Hybrid Feature Selection Method for Software Fault Prediction

, 2019
Yiheng Jian, Xiao Yu, Xu Zhou, Ziyi Ma
openalex   +2 more sources

Soft Beats: A Dielectric Elastomer‐Based Ventricular Assist Device for Next‐Gen Heart Failure Management

Advanced Engineering Materials, EarlyView.
The dielectric elastomer‐based electropneumatic device (DE‐EPD) is a vacuum‐assisted ventricular assist device (VAD) that delivers high performance (85 mmHg, 6.8 L min−1) with low power consumption. Unlike traditional motor‐driven VADs, it is lightweight, quiet, energy‐efficient, and provides pulsatile flow. Validated in a simulated circulation system,
Amine Benouhiba, Armando Walter, Silje Ekroll Jahren, Francesco Clavica, Dominik Obrist, Yoan Civet, Yves Perriard   +6 more
wiley   +1 more source

An explainable machine learning framework for railway predictive maintenance using data streams from the metro operator of Portugal. [PDF]

Sci Rep
García-Méndez S, de Arriba-Pérez F, Leal F, Veloso B, Malheiro B, Burguillo-Rial JC.   +5 more
europepmc   +1 more source

SCALABLE AND ADAPTIVE MACHINE LEARNING MODELS FOR EARLY SOFTWARE FAULT PREDICTION IN AGILE DEVELOPMENT: ENHANCING SOFTWARE RELIABILITY AND SPRINT PLANNING EFFICIENCY

Sai Krishna Gunda
openalex   +2 more sources

Genetic Evolutionary Learning Fitness Function (GELFF) for Feature Diagnosis to Software Fault Prediction

, 2019
P. Patchaiammal, R Thirumalaiselvi
openalex   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

Advanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke, John Wu, Alan L. Kastengren, Nikhilesh Chawla   +3 more
wiley   +1 more source

Advancing real-time validation of automotive software systems via continuous integration and intelligent failure analysis. [PDF]

Sci Rep
Abboush M, Knieke C, Rausch A.
europepmc   +1 more source

Linking Heat Treatment to Plastic Deformation in Pearlitic Steels Through Mesoscale Modeling

Advanced Engineering Materials, EarlyView.
Surface wear on rail and wheel steels results from surface deformation during use. This research uses mathematical models to forecast the plastic behavior of pearlitic steels, connected to the microstructure formed during heat treatment. While the cooling rate impacts the steels’ strength, the size of prior austenite grains and blocks does not ...
Saham Sadat Sharifi, Hamed Davoodi Jooneghani, Maria Domankova, Klaus Six, Gerald Trummer, Maria Cecilia Poletti   +5 more
wiley   +1 more source