Results 151 to 160 of about 4,059,453 (353)
An intentionally added, chemically formed LixAlSy coating stabilizes the lithium–electrolyte interface in solid‐state Li–S batteries. The layer suppresses side reactions, preserves smooth charge transfer, and improves ion transport from the start. This approach offers a practical route to more durable solid‐state batteries and a clearer understanding ...
Xinyi Wang +4 more
wiley +1 more source
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz +5 more
wiley +1 more source
Deconvolution beamforming based on a fast gradient algorithm for sound source localization
Ming Zan +4 more
openalex +1 more source
Additive manufacturing revolutionizes production by enabling on‐demand, customized, and sustainable manufacturing with streamlined supply chains. While metal and polymer AM are well‐established, advanced ceramic AM is rapidly emerging, overcoming traditional material challenges.
Kateryna Oleksandrivna Shvydyuk +2 more
wiley +1 more source
An Effective Perturbation Based Semi-Supervised Learning Method for Sound Event Detection
Xu Zheng +5 more
openalex +2 more sources
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Fractal dimensions of speech sounds: Computation and application to automatic speech recognition
Petros Maragos, Alexandros Potamianos
openalex +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source

