Results 161 to 170 of about 17,082,818 (379)
Sound Change Integration Error: An Explanatory Model of Tinnitus. [PDF]
Noda K, Kitahara T, Doi K.
europepmc +1 more source
Additive manufacturing revolutionizes production by enabling on‐demand, customized, and sustainable manufacturing with streamlined supply chains. While metal and polymer AM are well‐established, advanced ceramic AM is rapidly emerging, overcoming traditional material challenges.
Kateryna Oleksandrivna Shvydyuk +2 more
wiley +1 more source
Consistent sound change between stops and affricates in Seoul Korean within and across individuals: A diachronic investigation [PDF]
Hyunjung Lee
openalex +1 more source
Advanced Techniques for Scalable Woven E‐Textiles Manufacturing
This review highlights recent advances in scalable weaving techniques for e‐textiles, emphasizing innovations in multilayer structures, conductive yarn integration, and loom modifications. It summarizes emerging materials, fabrication strategies, and performance considerations that enable reliable, durable, and industrially scalable woven electronic ...
Faisal Abedin +2 more
wiley +1 more source
Future temperature and salinity in Puget Sound, Washington State, under CMIP6 climate change scenarios [PDF]
Stevie Walker +3 more
openalex +1 more source
Advancements in TLP Bonding for Power Electronics Die‐Attach Applications
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal +4 more
wiley +1 more source
Strategies for Enhancing Thermal Conductivity of PDMS in Electronic Applications
This review explores effective strategies for enhancing heat dissipation in Polydimethylsiloxane (PDMS)‐based composites, focusing on particle optimization, 3D network design, and multifunctional integration. It offers key insights into cutting‐edge methods and simulations that are advancing thermal management in modern electronic devices.
Xiang Yan, Marisol Martin‐Gonzalez
wiley +1 more source

